Abstract: A temperature-curable aminoplastic adhesive resin that is a (poly)-condensate of: (i) at least one aminoplast-forming chemical; (ii) 5-hydroxymethylfurfural (5-HMF), its oligomers and/or its isomers; and, (iii) at the least one second (poly-)condensable chemical produced in the presence of an organic sulfonic acid. Composite boards, such as wood-based panels, can be produced using this adhesive resin. The production of the aminoplastic adhesive resins includes the reaction of urea with 5-hydroxymethylfurfural (5-HMF) and glyoxal in the presence of an organic sulfonic acid as a hardener. The adhesive resin can be used in the production of wood-based panels, such as, particleboards, chipboards, fiberboards and products usually called, among others, plywood and/or blockboards, in the presence of an organic sulfonic during curing.

Abstract: A temperature-curable aminoplastic adhesive resin that is a (poly)-condensate of: (i) at least one aminoplast-forming chemical; (ii) 5-hydroxymethylfurfural (5-HMF), its oligomers and/or its isomers; and, (iii) at the least one second (poly-)condensable chemical. Composite boards, such as wood-based panels, can be produced using this adhesive resin. The production of the aminoplastic adhesive resin includes the reaction of urea with 5-hydroxymethylfurfural (5-HMF) and glyoxal. The adhesive resin can be used in the production of wood-based panels such as particleboards, fiberboards and products usually called, among others, plywood and/or blockboards.

Abstract: Particle or MFD boards are disclosed comprising an aminoplastic resins and yet exhibiting low emissions levels of formaldehyde, as well as methods to arrive at such boards.