Abstract: A method for producing a laminate made up of at least two films/foils is provided. At least one first film/foil is structured and subsequently laminated to at least one second film/foil. The at least one second film/foil is punched by at least one tool in a single working step and is laminated to the structured first film/foil simultaneously. The films/foils are conveyed, at least part of the time, to the at least one tool. A laminate produced according to such a method and a device for producing a laminate using such a method are also provided. The device is suited for conveying and laminating the at least one first and second films/foils, wherein regions of the films/foils are aligned to be parallel with respect to each other. The device includes at least one tool that can be used to punch-laminate second film/foil onto the first film/foil.

Abstract: A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.

Abstract: A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.