Patents by Inventor Manfred Heym

Manfred Heym has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stabilized polyester molding compositions
    Patent number: 5733959
    Abstract: Thermoplastic molding compositions compriseA) from 20 to 99% by weight of a polyester, up to 90% by weight of which may be replaced by a polycarbonate or a polyamide,B) from 0.1 to 7% by weight of a carbodiimide of the formula I ##STR1## where R.sup.1 are identical or different radicals selected from the group consisting of --NCO, --NHCONHR.sup.5, --NHCONR.sup.5 R.sup.6 and --NHCOOR.sup.7, whereR.sup.5 , R.sup.6 are identical or different and are alkyl, cycloalkyl or aralkyl,R.sup.7 is the same as R.sup.5 or is alkoxy(poly)oxyalkylene andR.sup.2 , R.sup.3 are identical or different aliphatic radicals having from 1 to 18 carbon atoms or cycloaliphatic radicals having from 5 to 15 carbon atoms or aromatic radicals having from 6 to 15 carbon atoms,R.sup.
    Type: Grant
    Filed: May 30, 1997
    Date of Patent: March 31, 1998
    Assignee: BASF Aktiengesellschaft
    Inventors: Thomas Heitz, Manfred Heym, Klaus Muhlbach, Christoph Plachetta
  • Curable compositions based on epoxy resins
    Patent number: 4607069
    Abstract: A solvent-free curable composition has a long shelf life and consists ofA 100 parts by weight of an epoxy resin andB from 10 to 100 parts by weight of, as a curing agent for the epoxy resin, an aromatic diamine containing ##STR1## groups, with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 .mu.m. The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone. The curable composition is used in particular for the preparation of fiber-reinforced materials.
    Type: Grant
    Filed: July 3, 1985
    Date of Patent: August 19, 1986
    Assignee: BASF Aktiengesellschaft
    Inventors: Helmut Tesch, Manfred Heym, Walter Doerflinger, Herbert Stutz, Peter Neumann, Dietmar Nissen, Gerhard Schaefer
  • Curable epoxy resins
    Patent number: 4559398
    Abstract: A curable composition consisting ofA. 100 parts by weight of an epoxy resin,B. from 4 to 100 parts by weight of a conventional curing agent for epoxy resins, andC. from 0.1 to 5 parts by weight of an N-acylimidazole which possesses an aromatic acyl component which is substituted at the two positions ortho to the carbonyl groupcan be used to produce moldings, coatings, finishes, adhesives and composite fiber materials.
    Type: Grant
    Filed: July 31, 1984
    Date of Patent: December 17, 1985
    Assignee: BASF Aktiengesellschaft
    Inventors: Helmut Tesch, Andreas Henne, Manfred Heym, Herbert Stutz
  • Curable compositions based on epoxy resins
    Patent number: RE32628
    Abstract: A solvent-free curable composition has a long shelf life and consists ofA 100 parts by weight of an epoxy resin andB from 10 to 100 parts by weight of .[.,.]. .Iadd.4,4-bis-(para-aminobenzoyl)-piperazine .Iaddend.as a curing agent for the epoxy resin, .[.an aromatic diamine containing ##STR1## groups,.]. with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 .mu.m. .[.The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone..]. The curable composition is used in particular for the preparation of fiber-reinforced materials.
    Type: Grant
    Filed: November 24, 1986
    Date of Patent: March 22, 1988
    Assignee: BASF Aktiengesellschaft
    Inventors: Helmut Tesch, Manfred Heym, Walter Doerflinger, Herbert Stutz, Peter Neumann, Dietmar Nissen, Gerhard Schaefer