Abstract: Apparatus and method for depositing a uniformly micro-thin layer of fluid on the face of a panel or substrate by moving the panel face down in oppositely moving contiguously juxtaposed position with a thin sheet of said fluid substantially laminarly flowing across a horizontal weir. The weir is so arranged as to form an acute angle between direction of fluid travel and the plane of movement of the piece to be coated. Once the panel touches the surface of the moving sheet of fluid, the surface tension between the fluid and panel causes a uniform micro-thin layer of the fluid to be deposited on the panel. If the method is used for lacquer or resist application, the layer of fluid is then baked onto the panel until it is dried into a solid. If the method is used for developing or rinsing photo plates or semi-conductor wafers, a slightly turbulent flow across the weir is desirable and the excess liquid remaining on the substrates may be blown off by a stream of high velocity gases.