Abstract: The invention relates to a method for registering a rotary press (3) for a printing process, wherein “n” inking systems (Fn) each produce monochrome printed images (6) and print one on top of the other thereby producing n-colored printed images, wherein the images (6) of the printed material (1) are shot by at least one sensor station (S), information on the rotary movements of the printing plate cylinders (Dn) is recorded and the images (9) [sic: (6)] and the information are used to produce correction signals, which actuate the actuators of the printing plate cylinders (Dn) until the deviation of the monochrome images (6) of the respective inking systems (Fn) from a desired position on the material to be printed (1) lies within defined range of tolerance values.

Abstract: The present invention describes a multi-color rotary printing machine in which one printing plate support (1) each is assigned to the colors that are transferred onto the print substrate. This printing plate support (1) supports a printing plate (6) and can be attached to a mandrel or a cylinder (5) of a rotary printing machine in order to transfer the print image onto the print substrate. The rotary printing machine has register devices (6, 7, 8) that determine the position of the printing plates (6) with respect to one another and comprise sensors (3) that determine the positions of the printing plate support (1) in the printing machine. Furthermore, the present invention describes and claims printing plate supports (1) that form a system together with the printing machine according to the invention. Processes for operating printing machines according to this invention are also the subject of the matter for which protection is sought.

Abstract: To compactly design a circuit configuration of a plurality of electronic components a power semiconductor module, in particular, an externally controllable, matrix converter has conduction devices for input, control, and output signals and/or a connecting device for the electronic components formed among one another as a bus structure on a base substrate.

Abstract: To compactly design a circuit configuration of a plurality of electronic components a power semiconductor module, in particular, an externally controllable, matrix converter has conduction devices for input, control, and output signals and/or a connecting device for the electronic components formed among one another as a bus structure on a base substrate.

Abstract: A connecting device for power semiconductor modules with compensation for mechanical stresses includes a sleeve connected to a substrate and having a region with a given very small diameter. A wire pin is provided for insertion into the region of the sleeve during operation to form an electrical connection for a board. The wire pin has a diameter greater than the given diameter for clamping the wire pin upon insertion in the region. Axial freedom of movement of the wire pin in the sleeve makes it possible to avoid mechanical stresses resulting from different material characteristics when a temperature change takes place.

Abstract: In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.

Abstract: In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.

Abstract: A connecting device for power semiconductor modules with compensation for mechanical stresses includes a sleeve connected to a substrate and having a region with a given very small diameter. A wire pin is provided for insertion into the region of the sleeve during operation to form an electrical connection for a board. The wire pin has a diameter greater than the given diameter for clamping the wire pin upon insertion in the region. Axial freedom of movement of the wire pin in the sleeve makes it possible to avoid mechanical stresses resulting from different material characteristics when a temperature change takes place.