Abstract: The present disclosure relates to an integrated circuit arrangement. The circuit arrangement includes a semiconductor body having a first surface and defining a vertical direction running perpendicular to the first surface. At least one sensor line is at least partially arranged above the first surface, and includes a first and a second contact terminal and at least one vertical line section coupled between the first and second contact terminals and running in the vertical direction. An evaluation circuit is coupled to the first and second contact terminals and adapted to evaluate an impedance of the at least one sensor line.

Abstract: Embodiments of the invention provide a method and apparatus that enables plasma etching of high aspect ratio features. In one embodiment, a method for etching is provided that includes providing a substrate having a patterned mask disposed on a silicon layer in an etch reactor, providing a gas mixture of the reactor, maintaining a plasma formed from the gas mixture, wherein bias power and RF power provided the reactor are pulsed, and etching the silicon layer in the presence of the plasma.

Abstract: The invention relates, inter alia, to a method for testing a programmable memory cell having a particular memory state, the method involving the following steps of: applying a first read signal to the memory cell, with the result that the memory cell provides a first memory signal which represents its memory state; comparing the first memory signal with a threshold value in order to obtain a first comparison result; applying a second read signal to the memory cell, with the result that the memory cell provides a second memory signal which represents its memory state; comparing the second memory signal with the threshold value in order to obtain a second comparison result; assessing the integrity of the memory state using the two comparison results.