Abstract: The container and transfer process are intended to prevent stop contamination of semiconductor devices from occurring, even if the container is stored or handled under unclean room conditions. The semiconductor devices are subjected to an approximately laminar clean air stream passing around them in a clean air zone. A higher static pressure is maintained in the clean air zone than in the surrounding space which might be polluted with an inadmissibly high number of particles. The clean air stream carries along any dirt particles there may still be, so that they cannot settle on the semiconductor devices. Owing to the higher static pressure, a forced flow from the clean air zone of the higher static pressure outwards into the surrounding space is achieved, thus preventing an ingress of dirt particles from the surrounding space.