Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract: The structure consists of at least one glass-ceramic sheet (1) with holes (3) being filled with a conductive material (4) having a TCE slightly higher than that of the glass-ceramics and having undergone liquid phase sintering at the crystallization temperature of the glass-ceramic material (2) with the solid phase comprising conductive particles (5) and the liquid phase comprising at least a glass (6).The method comprises the steps of providing a green sheet comprising an organic vehicle and particles of a crystallizable first glass and having via holes, filling the via holes with a paste comprising an organic vehicle, and an inorganic material comprising conductive particles and at least a second glass being low viscous at the sintering temperature, firing the then present structure in a reducing, neutral or slightly oxidizing atmosphere with the temperature being slowly raised to said sintering temperature and slowly cooling the structure.