Abstract: An optical element is provided for beam shaping for radiation emitted by a radiation-emitting semiconductor chip. The optical element includes a radiation entrance face and a boundary surface different from the radiation entrance face with a first region and a second region. The first and second regions are arranged and embodied such that a first radiation portion of radiation entering the optical element through the radiation entrance face is reflected in the first region and after reflection in the first region is deflected in the second region towards a plane defined by the radiation entrance face.

Abstract: A mixed light source has a first semiconductor component, which is provided for generating a first radiation fraction, and a second semiconductor component, which is provided for generating radiation of a second radiation fraction different from the first radiation fraction. The first semiconductor component is mounted by a first mounting point on a first heat sink with a first thermal resistance R1. The second semiconductor component is mounted by a second mounting point on a second heat sink with a second thermal resistance R2. The thermal resistances R1 and R2 are different from one another.

Abstract: An optical element is provided for beam shaping for radiation emitted by a radiation-emitting semiconductor chip. The optical element includes a radiation entrance face and a boundary surface different from the radiation entrance face with a first region and a second region. The first and second regions are arranged and embodied such that a first radiation portion of radiation entering the optical element through the radiation entrance face is reflected in the first region and after reflection in the first region is deflected in the second region towards a plane defined by the radiation entrance face.

Abstract: A mixed light source has a first semiconductor component, which is provided for generating a first radiation fraction, and a second semiconductor component, which is provided for generating radiation of a second radiation fraction different from the first radiation fraction. The first semiconductor component is mounted by a first mounting point on a first heat sink with a first thermal resistance R1. The second semiconductor component is mounted by a second mounting point on a second heat sink with a second thermal resistance R2. The thermal resistances R1 and R2 are different from one another.

Abstract: A thin-film semiconductor component includes a carrier and a semiconductor body with a semiconductor layer sequence including an active region provided to generate radiation. The semiconductor body is externally electrically contactable by a first contact and a second contact. The carrier includes a protection diode structure connected electrically in parallel to the semiconductor body. The protection diode structure includes a first diode and a second diode. The first diode and the second diode are electrically connected in series in mutually opposing directions with regard to their forward direction.

Abstract: The invention relates to a method for producing an optical arrangement (10, 300), in which an optical component (355, 20) is optically connected to at least one waveguide (90, 320, 330) provided on or in a carrier substrate (100, 310). In order to enable an optical component to be connected to an optical waveguide of a carrier substrate in a particularly simple and thus cost-effective manner, the invention provides for there to be arranged between the optical component (20, 355) and the waveguide (90, 320, 330) an adjustment device (40, 350) with at least one auxiliary waveguide (60, 410, 440), the waveguide ends (50, 70, 400, 420, 430, 450) of which are in each case movable and an optical adjustment between the optical component (20, 355) and the waveguide (90, 320, 330) of the carrier substrate (100, 310) is effected by a mechanical adjustment of the movable waveguide ends (50, 70, 400, 420, 430, 450).

Abstract: The invention relates to a method for producing an optical arrangement (10, 300), in which an optical component (355, 20) is optically connected to at least one waveguide (90, 320, 330) provided on or in a carrier substrate (100, 310). In order to enable an optical component to be connected to an optical waveguide of a carrier substrate in a particularly simple and thus cost-effective manner, the invention provides for there to be arranged between the optical component (20, 355) and the waveguide (90, 320, 330) an adjustment device (40, 350) with at least one auxiliary waveguide (60, 410, 440), the waveguide ends (50, 70, 400, 420, 430, 450) of which are in each case movable and an optical adjustment between the optical component (20, 355) and the waveguide (90, 320, 330) of the carrier substrate (100, 310) is effected by a mechanical adjustment of the movable waveguide ends (50, 70, 400, 420, 430, 450).