Patents by Inventor Manfred Schofberger

Manfred Schofberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the wet-chemical surface treatment of a semiconductor wafer
    Publication number: 20040266191
    Abstract: A process for the wet-chemical surface treatment of a semiconductor wafer has the semiconductor wafer being treated with an acidic liquid, with at most 10 &mgr;m of material being removed from each surface of the semiconductor wafer, and then this wafer is treated with an alkaline liquid, with at least sufficient material being removed for the crystal regions which have been damaged by a previous mechanical treatment to be completely removed.
    Type: Application
    Filed: June 25, 2004
    Publication date: December 30, 2004
    Inventors: Gunter Schwab, Helmut Franke, Helmut Paltzer, Manfred Schofberger, Maximilian Stadler
  • Process for producing a semiconductor wafer
    Patent number: 6767841
    Abstract: A process for producing a semiconductor wafer is based upon etching the semiconductor wafer with an etching medium flowing in a laminar flow along a direction of flow toward an edge of the semiconductor wafer. There is a protective shield arranged in front of the edge of the semiconductor wafer, so that the etching medium flows onto the protective shield and not onto the edge of the semiconductor wafer. There is also a process that has the semiconductor wafer being inclined with respect to the direction of flow of the etching medium, so that there is an angle of less than 180° between the direction of flow of the etching medium and a first side of the semiconductor wafer. Also, there is an angle of greater than 180° between the direction of flow of the etching medium and a second side of the semiconductor wafer, and the second side of the semiconductor wafer is subsequently polished.
    Type: Grant
    Filed: January 18, 2001
    Date of Patent: July 27, 2004
    Assignee: Siltronic AG
    Inventors: Günter Schwab, Helmut Franke, Manfred Schöfberger
  • Process for producing a semiconductor wafer
    Publication number: 20030022506
    Abstract: A process for producing a semiconductor wafer is based upon etching the semiconductor wafer with an etching medium flowing in a laminar flow along a direction of flow toward an edge of the semiconductor wafer. There is a protective shield arranged in front of the edge of the semiconductor wafer, so that the etching medium flows onto the protective shield and not onto the edge of the semiconductor wafer. There is also a process that has the semiconductor wafer being inclined with respect to the direction of flow of the etching medium, so that there is an angle of less than 180° between the direction of flow of the etching medium and a first side of the semiconductor wafer. Also, there is an angle of greater than 180° between the direction of flow of the etching medium and a second side of the semiconductor wafer, and the second side of the semiconductor wafer is subsequently polished.
    Type: Application
    Filed: January 18, 2001
    Publication date: January 30, 2003
    Inventors: Gunter Schwab, Helmut Franke, Manfred Schofberger