Abstract: The invention relates to a tube cathode with a target carrier and a target. The target can herein be a single- or a multi-part target. Between target carrier and target are placed several annular elements of a thermally conductive material along the longitudinal axis of the target carrier. The annular elements are separated from one another by narrow rings. The target has on at least one end face a chamfer, which permits sliding the target readily over the discrete annular elements.

Abstract: A system 1 for coating a substrate 3, in particular a transparent substrate, comprises at least one coating chamber 2, at least one pump means 5 for producing a vacuum within the coating chamber 2, and at least one sputtering cathode 9. One or more cathodes 9 are integrated within an insert 8 together with system components which undergo process-induced dirt pick-up, for example shields, covers or transport rollers 6 for conveying a substrate 3 through the process chamber 2. The insert 8 can slide, like a drawer, through a lateral opening 10 within the chamber wall 2a, into the interior of the chamber. For maintenance purposes, any components of the coating system 1 which require thorough maintenance and cleaning can be removed easily from the interior of the coating chamber 2 by means of the insert 8. The removed insert 8 can be replaced directly by an insert that has just been serviced.

Abstract: A gate valve (1) is constructed for the simultaneous blocking or clearing of two rectangular passage openings (8,9) of two chamber walls (4,5) that are provided between two vacuum chambers (1,3) and aligned with one another. To this end, it has two valve plates (20, 21), which are a component of a slider (15), which is situated so that it can move with play from a position clearing the passage openings (8,9) to a position which closes the passage openings (8,9). To move the valve plates (20,21) to the closing setting against the passage openings (8,9) on the slider (15), at least one lifting element (24), which is acted on by pressure, is provided.

Abstract: A device for coating plate-shaped substrates by using cathode sputtering has several process chambers one after the other, each of which are bordered on the top by a chamber roof having in each case an opening. In this opening, which is covered at the top by a cathode arrangement, a frame is inserted. Screens and coolant lines of the process chamber are provided on the frame that can slide upwards out of the opening, projects into the process chamber, and is supported inside the opening of the chamber roof. A top of the cathode arrangement projects over the frame on the sides and is supported directly on the chamber roof so it seals it.

Abstract: A dual magnetron cathode assembly includes a pair of elongate, parallel targets in coplanar relationship fixed to respective magnetic yokes with associated rows of permanent magnets for producing a magnetic field over the targets. A common back plate is provided for both cathodes, a center shield plate extending from the back plate to between the targets, side shield plates and end shield plates likewise extending from the back plate to form side-by-side rectangular shielding enclosures which expose only the sputtering surface of the targets. The yokes are fixed with respect to the vacuum chamber by insulative holders which extend through openings in the back plate.

Abstract: A cover fitted about the periphery of an opening in a chamber wall is provided with a channel having therein both high frequency sealing elements which prevent escape of electromagnetic radiation, and a vacuum sealing element. The HF sealing elements are spaced apart by less than 1/4 of the minimum wavelength .lambda. to be shielded against, and are preferably held in the channel by a profiled element which also holds the vacuum sealing element. Alternatively, the channel may be provided in the chamber wall, or the sealing elements may he held in place without any channel.

Abstract: Hollow members having conduits for process gas and coolant are mounted in parallel on sidewall of a vacuum chamber with a sputtering cathode therebetween. Anode members having an L-shaped cross section are mounted over the hollow members and held in place by thumb screws in threaded bores of strips fixed to the chamber walls above the hollow members. Mask members having a Z-shaped cross section are mounted over the anodes and are also held in place by the thumb screws.

Abstract: A pair of parallel elongate targets are fixed with respect to respective plates mounted in a vacuum chamber by means of clamps arranged along the longitudinal sides of each target, and an expandable wedge system between the rear plate and magnetic yokes on the backs of the targets. The wedge system for each target includes a wedge block having ramped surfaces which face outward, a pair of wedge jaws having ramped surfaces which slide against the ramped surfaces of the block, and a screw which draws the jaws together against the ramped surfaces of the block to expand the system and force the plate away from the yoke and fix the entire assembly in the clamps.

Abstract: Cathode sputtering apparatus includes a target, a cooling channel, and a flexible diaphragm therebetween. The target is fixed to a base independently of the diaphragm, so that the target can be replaced with disturbing the cooling channel. In a preferred embodiment, the diaphragm and the target are fixed by respective sets of cleats retained by screws received from respective opposite directions.

Abstract: In a device for the releasable fastening of a target (3) or target base (5) together with a magnet yoke (31) on the cathode mounting of the process chamber in a cathode sputtering apparatus, the target base (5) is provided with locking toggles (11, . . . ) extending perpendicular to the target plane and able to enter through openings (42, . . . ) in the bottom of the magnet yoke (31) and cooperating with locking levers or disks journaled on the cathode mounting or arresting device (17) in the manner of a bayonet lock or of a bascular lock and after being turned pull the target base (5) tightly onto the cathode mounting or release the locking toggles (11, . . . ) so that the target (3) can be removed from the cathode mounting.

Abstract: A vacuum coating device having a workpiece carrier rotatably positioned within the process chamber including a device for positioning and releasably securing the workpiece on the carrier comprising a crank-lever mechanism positioned at a transfer station and a clamping mechanism positioned on the carrier. The crank lever mechanism operatively engages the clamping mechanism to release or secure a workpiece on the carrier.

Abstract: A cathode sputtering system for coating substrates in a vacuum chamber in which a rotating substrate carrier is accommodated and comprises at least one conveyor spoon. The conveyor spoon comprises a substrate receptacle member and an arm attached between the receptacle member and a rotating disk. The arm preferably comprises two leaf springs arranged parallel to one another. During the sputtering process, a pressure plate presses the substrate receptacle member and the substrate against a mask that is part of the cathode station. As a result, a cathode vacuum space is formed that is isolated from the vacuum space of the system.