Abstract: The invention relates to a substrate (2) for manufacturing an organic conversion device for converting electrical energy into light energy or light energy into electrical energy, wherein the substrate comprises a) an encapsulation layer (3) on the substrate, wherein the encapsulation layer includes a first inorganic layer (7), a second inorganic layer (9) and an intermediate organic layer (8), and b) a getter reservoir (6) in contact with the organic layer of the encapsulation layer. Water molecules will therefore not only be transported along the intermediate organic layer, but will also be gathered, especially absorbed, by the getter reservoir, if the encapsulation is damaged. This can slow down a transport of water molecules along a leakage path towards an organic conversion layer of the organic conversion device and hence slow down a possible degradation of the performance of the organic conversion device, if the encapsulation layer is damaged.

Abstract: The invention describes an OLED device (1) comprising an organic layer (3) which emits light (L1) in operation and which is positioned between an essentially transparent anode layer (5) and an essentially opaque cathode layer (7). The cathode layer (7) is deliberately structured along a main extension plane (EP) of the OLED device to comprise at least one cathode region (11, 11a, 11b) in which the cathode layer (7) is 10 present and a plurality of cathode-free regions (13, 13a, 13b) and/or at least one cathode-free region (13, 13a, 13b) of a larger extension, through which cathode-free regions and/or region (13, 13a, 13b) visible light (L2) can pass in the direction of a cross extension (CE) of the OLED device. The invention also describes a production method of such OLED device (1).

Abstract: The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.

Abstract: The invention relates to a substrate (2) for manufacturing an organic conversion device for converting electrical energy into light energy or light energy into electrical energy, wherein the substrate comprises a) an encapsulation layer (3) on the substrate, wherein the encapsulation layer includes a first inorganic layer (7), a second inorganic layer (9) and an intermediate organic layer (8), and b) a getter reservoir (6) in contact with the organic layer of the encapsulation layer. Water molecules will therefore not only be transported along the intermediate organic layer, but will also be gathered, especially absorbed, by the getter reservoir, if the encapsulation is damaged. This can slow down a transport of water molecules along a leakage path towards an organic conversion layer of the organic conversion device and hence slow down a possible degradation of the performance of the organic conversion device, if the encapsulation layer is damaged.

Abstract: The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.

Abstract: The invention describes an OLED device (1) comprising an organic layer (3) which emits light (L1) in operation and which is positioned between an essentially transparent anode layer (5) and an essentially opaque cathode layer (7). The cathode layer (7) is deliberately structured along a main extension plane (EP) of the OLED device to comprise at least one cathode region (11, 11a, 11b) in which the cathode layer (7) is 10 present and a plurality of cathode-free regions (13, 13a, 13b) and/or at least one cathode-free region (13, 13a, 13b) of a larger extension, through which cathode-free regions and/or region (13, 13a, 13b) visible light (L2) can pass in the direction of a cross extension (CE) oft he OLED device. The invention also describes a production method of such OLED device (1).