Patents by Inventor Manfred Topfer

Manfred Topfer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip arrangement and method of producing the same
    Patent number: 5959352
    Abstract: A chip arrangement has a first chip, a connecting device and at least a second chip or a substrate. The connecting device has a plurality of individual, spaced diamond parts which are arranged between the chips or between the first chip and the substrate and are connected to these such that the chips or the chip and the substrate are connected together via the diamond parts only. Methods for producing a chip arrangement of this kind comprise either the application of a diamond layer over the whole surface of the substrate and the subsequent structuring of the diamond layer to define individual, spaced diamond parts or the application of individual diamond parts to either the first chip or the second chip or the substrate such that they are arranged in spaced relationship with one another. The individual, spaced diamond parts are subsequently connected to the other component which is to be connected such that they are connected via the diamond parts only.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: September 28, 1999
    Assignee: Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V.
    Inventors: Manfred Topfer, Eberhard Kaulfersch, Stefan Weib, Herbert Reichl