Patents by Inventor Manfred Walker

Manfred Walker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a circuitized substrate assembly with carrier having substrates therein
    Patent number: 6338194
    Abstract: A method of making an assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired locking means. The method is adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier.
    Type: Grant
    Filed: January 3, 2000
    Date of Patent: January 15, 2002
    Assignee: International Business Machines Corporation
    Inventors: Gerhard Benz, Jürgen Finze, Manfred Walker
  • Method of making a circuitized substrate assembly with carrier having substrates therein
    Patent number: 6035525
    Abstract: An assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired locking means. The assembly is thus adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier. The carrier can be of metal or recyclable plastic material.
    Type: Grant
    Filed: January 25, 1999
    Date of Patent: March 14, 2000
    Assignee: International Business Machines Corporation
    Inventors: Gerhard Benz, Jurgen Finze, Manfred Walker
  • Circuitized substrate assembly with carrier having substrates therein
    Patent number: 5866852
    Abstract: An assembly of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier. Tabs on the carrier engage slots in each substrate to align the substrates with respect to the carrier. At least one pair of male projections on each substrate frictionally engage female retaining members in the carrier to lock each substrate with respect to the carrier. The assembly is thus adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier. The carrier can be of metal or recyclable plastic material.
    Type: Grant
    Filed: January 6, 1997
    Date of Patent: February 2, 1999
    Assignee: International Business Machines Corporation
    Inventors: Gerhard Benz, Jurgen Finze, Manfred Walker