Abstract: The present document relates to power converters. In particular, the present document relates to the protection of the power switches of power converters. A controller configured to control a switched-mode power converter is described. The controller comprises a control pin for controlling a state of a power switch of the switched-mode power converter using a control signal; and a sensing pin for receiving a sensed current signal indicative of a current through the power switch. The controller is configured to detect a break-through situation of the power switch based on the state of the power switch and based on the sensed current signal.

Abstract: The present document relates to power converters. In particular, the present document relates to the protection of the power switches of power converters. A controller configured to control a switched-mode power converter is described. The controller comprises a control pin for controlling a state of a power switch of the switched-mode power converter using a control signal; and a sensing pin for receiving a sensed current signal indicative of a current through the power switch. The controller is configured to detect a break-through situation of the power switch based on the state of the power switch and based on the sensed current signal.

Abstract: A micromechanical capacitive acceleration sensor is described for picking up the acceleration of an object in at least one direction. The sensor includes a frame structure (110), a sensor inertia mass (101) made of a wafer and movably mounted relative to the frame structure (110) about a rotation axis, and a capacitive pick-up unit (120) for producing at least one capacitive output signal representing the position of the sensor mass (101) relative to the frame structure (110). The sensor inertia mass (101) has a center of gravity which offset relative to the rotation axis in a direction perpendicularly to a wafer plane for measuring accelerations laterally to the wafer plane. The sensor mass (101) and the frame structure (110) are made monolithically of one single crystal silicon wafer. A cover section (112) forms a common connector plane (150) for the connection of capacitor electrodes (125,126). Torqueable elements (105) form an electrically conducting bearing device for the sensor mass (101).

Abstract: The invention concerns a process for driving a sensor with offset control. Such processes for driving are required, for example, to be used in acceleration transducers in motor vehicles for triggering, e.g., airbags or belt-tensioning devices. However, with existing processes the output nominal signal was repeatedly corrupted, e.g., by temperature-related interference signals, also known as the offset. In addition, existing systems are unreliable during turn-on. However, with the process according to this invention, the sign and the value of the difference between the output signal and a reference voltage is detected at a fixed or variable time pulse, with the sign changing the measuring voltage at the output and the difference value determining the clock frequency for this control process. Also, during turn-on a significantly increased clock frequency will be reduced in stages until the operating frequency is reached.

Abstract: A piezoelectric acceleration transducer characterized by a flexible element formed of a piezoelectric material with two external electrodes, a support member having two plate-type supporting components between which the flexible member is arranged, and a carrier plate to which the support member is mechanically and electrically connected such that the principal axis of sensitivity of the flexible element lies in the same plane as the carrier plate. The supporting components may be formed of a nonconducting material with a electrically conductive coating on the side facing the flexible element and at a point of contact with the carrier base. Alternatively, the supporting components may be made from an electrically conductive material.

Abstract: System for packaging integrated circuits, especially sensors, in a housing, which also comprises multicontact bondings, especially hybrid ICs for three-dimensional arrangement of modules, wherein sensors (4, 5) are arranged at an angle in relation to one another on the base plate or the substrate (1). The sensors are contained in the single housing together with contact pins (pins) (2), and are connected in one plane by automatic bonding.