Patents by Inventor Manfred Zaeske

Manfred Zaeske has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Housing assembly for an electronic device and method of packaging an electronic device
    Patent number: 6713677
    Abstract: A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: March 30, 2004
    Assignee: Infineon Technologies AG
    Inventors: Reinhard Fischbach, Manfred Fries, Manfred Zaeske
  • Housing assembly for an electronic device and method of packaging an electronic device
    Publication number: 20030090007
    Abstract: A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.
    Type: Application
    Filed: September 30, 2002
    Publication date: May 15, 2003
    Inventors: Reinhard Fischbach, Manfred Fries, Manfred Zaeske