Patents by Inventor Manhong Zhao

Manhong Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer substrate and method for manufacturing the same
    Patent number: 9558859
    Abstract: The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability of electronic packages. The slip layer substrate comprises: a base material; a first metallization layer formed on the base material; a first diffusion barrier layer formed on the first metallization layer; a slip layer formed on the first diffusion barrier layer; a second diffusion barrier layer formed on the slip layer; and a second metallization layer formed on the second diffusion barrier layer.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: January 31, 2017
    Assignee: RSM ELECTRON POWER, INC.
    Inventors: Ching Au, Manhong Zhao, Robert Conte
  • MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20150237724
    Abstract: The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability of electronic packages. The slip layer substrate comprises: a base material; a first metallization layer formed on the base material; a first diffusion barrier layer formed on the first metallization layer; a slip layer formed on the first diffusion barrier layer; a second diffusion barrier layer formed on the slip layer; and a second metallization layer formed on the second diffusion barrier layer.
    Type: Application
    Filed: February 18, 2014
    Publication date: August 20, 2015
    Applicant: RSM Electron Power, Inc.
    Inventors: Ching Au, Manhong Zhao, Robert Conte