Abstract: A method and apparatus for EMI shielding of an electronic package is described. The method includes applying a patterned package support to a transport tray, and placing one or more electronic packages in aligned contact with one or more open features of the patterned package support such that a peripheral region of the electronic package contacts an upper surface of the patterned package support and a central region overhangs the open feature. The method further includes depositing one or more metal layers onto the one or more electronic packages and patterned package support, wherein the open features in the patterned package support allow metal layer deposition on the sidewalls of the one or more electronic packages and protect at least a portion of the underside of the one or more electronic packages.

Abstract: Techniques disclosed herein include a method and apparatus for stripping resist from a substrate without using high concentrations of toxic chemicals and without needing frequent bath replacement. Techniques include using a chemistry that lifts-off the resist, without substantially dissolving the resist, coupled with mechanically breaking removed resist into small particles using mechanical agitation and high fluid flow. Resist particles can then be removed from the vicinity of the wafer by a high-flow circulation out of a processing tank. Circulating flow can then be filtered to remove the resist particles from the circulating fluid and reintroduced into the processing tank. A filtering system can also remove particles from filters either during circulation or with circulation stopped.