Patents by Inventor Mani Subramani
Mani Subramani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11721532Abstract: Embodiments include methods and apparatuses that include a plasma processing tool that includes a plurality of magnets. In one embodiment, a plasma processing tool may comprise a processing chamber and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources includes an array of applicators positioned over a dielectric plate that forms a portion of an outer wall of the processing chamber, and an array of microwave amplification modules. In an embodiment, each microwave amplification module is coupled to one or more of the applicators in the array of applicators. In an embodiment, the plasma processing tool may include a plurality of magnets. In an embodiment, the magnets are positioned around one or more of the applicators.Type: GrantFiled: June 3, 2021Date of Patent: August 8, 2023Assignee: Applied Materials, Inc.Inventors: Philip Allan Kraus, Thai Cheng Chua, Mani Subramani
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Publication number: 20210287882Abstract: Embodiments include methods and apparatuses that include a plasma processing tool that includes a plurality of magnets. In one embodiment, a plasma processing tool may comprise a processing chamber and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources includes an array of applicators positioned over a dielectric plate that forms a portion of an outer wall of the processing chamber, and an array of microwave amplification modules. In an embodiment, each microwave amplification module is coupled to one or more of the applicators in the array of applicators. In an embodiment, the plasma processing tool may include a plurality of magnets. In an embodiment, the magnets are positioned around one or more of the applicators.Type: ApplicationFiled: June 3, 2021Publication date: September 16, 2021Inventors: Philip Allan Kraus, Thai Cheng Chua, Mani Subramani
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Patent number: 11037764Abstract: Embodiments include methods and apparatuses that include a plasma processing tool that includes a plurality of magnets. In one embodiment, a plasma processing tool may comprise a processing chamber and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources includes an array of applicators positioned over a dielectric plate that forms a portion of an outer wall of the processing chamber, and an array of microwave amplification modules. In an embodiment, each microwave amplification module is coupled to one or more of the applicators in the array of applicators. In an embodiment, the plasma processing tool may include a plurality of magnets. In an embodiment, the magnets are positioned around one or more of the applicators.Type: GrantFiled: May 6, 2017Date of Patent: June 15, 2021Assignee: Applied Materials, Inc.Inventors: Philip Allan Kraus, Thai Cheng Chua, Mani Subramani
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Publication number: 20180323043Abstract: Embodiments include methods and apparatuses that include a plasma processing tool that includes a plurality of magnets. In one embodiment, a plasma processing tool may comprise a processing chamber and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources includes an array of applicators positioned over a dielectric that forms a portion of an outer wall of the processing chamber, and an array of microwave amplification modules. In an embodiment, each microwave amplification module is coupled to one or more of the applicators in the array of applicators. In an embodiment, the plasma processing tool may include a plurality of magnets. In an embodiment, the magnets are positioned around one or more of the applicators.Type: ApplicationFiled: May 6, 2017Publication date: November 8, 2018Inventors: Philip Allan Kraus, Thai Cheng Chua, Mani Subramani
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Publication number: 20130168232Abstract: A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.Type: ApplicationFiled: February 25, 2013Publication date: July 4, 2013Inventors: Jaim NULMAN, Sergio EDELSTEIN, Mani SUBRAMANI, Zheng XU, Howard E. GRUNES, Avi TEPMAN, John C. FORSTER, Praburam GOPALRAJA
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Patent number: 8398832Abstract: A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.Type: GrantFiled: September 15, 2005Date of Patent: March 19, 2013Assignee: Applied Materials Inc.Inventors: Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard E. Grunes, Avi Tepman, John C. Forster, Praburam Gopalraja
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Publication number: 20060070875Abstract: A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.Type: ApplicationFiled: September 15, 2005Publication date: April 6, 2006Inventors: Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes, Avi Tepman, John Forster, Praburam Gopalraja
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Publication number: 20040256217Abstract: A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.Type: ApplicationFiled: July 20, 2004Publication date: December 23, 2004Inventors: Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes, Avi Tepman, John Forster, Praburam Gopalraja
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Patent number: 6783639Abstract: A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.Type: GrantFiled: January 17, 2002Date of Patent: August 31, 2004Assignee: Applied MaterialsInventors: Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes, Avi Tepman, John Forster, Praburam Gopalraja
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Publication number: 20020144901Abstract: A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.Type: ApplicationFiled: January 17, 2002Publication date: October 10, 2002Inventors: Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes, Avi Tepman, John Forster, Praburam Gopalraja
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Patent number: 6368469Abstract: A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.Type: GrantFiled: May 6, 1997Date of Patent: April 9, 2002Assignee: Applied Materials, Inc.Inventors: Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes, Avi Tepman, John Forster, Praburam Gopalraja
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Patent number: 6254737Abstract: A combination coil and shield for a plasma chamber in a semiconductor fabrication system is provided. The coil-shield has a plurality of turns to couple energy efficiently into a plasma and also substantially blocks deposition material from reaching a second shield positioned behind the first shield.Type: GrantFiled: October 8, 1996Date of Patent: July 3, 2001Assignee: Applied Materials, Inc.Inventors: Sergio Edelstein, Mani Subramani