Abstract: An electronic device includes a first device housing coupled to a second device housing by a hinge. A heat spreader is coupled to the first device housing and the second device housing and spans the hinge. A flexible display coupled to the first device housing and the second device housing and spans the hinge. The heat spreader and the flexible display can be coupled to the first device housing and the second device housing, respectively, at different locations. Alternatively, the flexible display can be coupled to the heat spreader at a location that is collocated with the location at which the heat spreader is coupled to the first device housing and the second device housing, respectively.

Abstract: An electronic device includes a first device housing coupled to a second device housing by a hinge. A heat spreader is coupled to the first device housing and the second device housing and spans the hinge. A flexible display coupled to the first device housing and the second device housing and spans the hinge. The heat spreader and the flexible display can be coupled to the first device housing and the second device housing, respectively, at different locations. Alternatively, the flexible display can be coupled to the heat spreader at a location that is collocated with the location at which the heat spreader is coupled to the first device housing and the second device housing, respectively.

Abstract: An electronic device includes a first device housing coupled to a second device housing by a hinge. A heat spreader is coupled to the first device housing and the second device housing and spans the hinge. A flexible display coupled to the first device housing and the second device housing and spans the hinge. The heat spreader and the flexible display can be coupled to the first device housing and the second device housing, respectively, at different locations. Alternatively, the flexible display can be coupled to the heat spreader at a location that is collocated with the location at which the heat spreader is coupled to the first device housing and the second device housing, respectively.

Abstract: An electronic device includes a microphone coupled to a first substrate, a second substrate defining an acoustic port, and a pressure relief device situated between the first substrate and the second substrate. The pressure relief device includes a bore defining an acoustic duct through which the microphone receives acoustic energy from the acoustic port. The pressure relief device also includes a venting section. The venting section breaches the acoustic duct when a pressure within the acoustic duct exceeds a predefined pressure threshold.

Abstract: An electronic device includes a microphone coupled to a first substrate, a second substrate defining an acoustic port, and a pressure relief device situated between the first substrate and the second substrate. The pressure relief device includes a bore defining an acoustic duct through which the microphone receives acoustic energy from the acoustic port. The pressure relief device also includes a venting section. The venting section breaches the acoustic duct when a pressure within the acoustic duct exceeds a predefined pressure threshold.

Abstract: A method, a system, and computer program product for calculating an effective heat transfer coefficient of a device. The method includes measuring: an internal temperature of the device, a first temperature at a first location along a first resistive path of a parallel resistive network and a second temperature at a second location along a second resistive path of the parallel resistive network. An ambient temperature of the environment and an effective heat transfer coefficient of the device is then calculated based on the internal temperature, the first temperature, the second temperature, and resistive properties of the parallel resistive network. The ambient temperature and the effective heat transfer coefficient are provided to a thermal management component.

Abstract: A method, a system, and computer program product for calculating an effective heat transfer coefficient of a device. The method includes measuring: an internal temperature of the device, a first temperature at a first location along a first resistive path of a parallel resistive network and a second temperature at a second location along a second resistive path of the parallel resistive network. An ambient temperature of the environment and an effective heat transfer coefficient of the device is then calculated based on the internal temperature, the first temperature, the second temperature, and resistive properties of the parallel resistive network. The ambient temperature and the effective heat transfer coefficient are provided to a thermal management component.

Abstract: The heat sink has an interior and has a first exterior surface and a second exterior surface, and includes a first heat removal region disposed in the interior. The first heat removal region defines a first cavity and is at least partially filled with a liquid. The first heat removal region transfers a first amount of heat from a first electronic device via a pool boiling phenomenon when the first electronic device is disposed on the first exterior surface. A first conduction-inhibiting region is disposed proximate the first cavity. A second heat removal region is disposed in the interior. The second heat removal region defines a second cavity and is at least partially filled with the liquid. The second heat removal region transfers a second amount of heat from a second electronic device via the pool boiling phenomenon when the second electronic device is disposed on the first exterior surface.