Patents by Inventor Manish Pamwar

Manish Pamwar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chassis assembly having mixed materials
    Patent number: 11724746
    Abstract: A chassis assembly having mixed material for reduced mass is provided. The assembly comprises an upper structure comprised of metal. The upper structure has a plurality of first bond surfaces, each of which is parallel with each other at varying elevations relative to a z-axis of a 3-dimensional coordinate thereof. The assembly further comprises a lower structure made of a polymer composite. The lower structure has a plurality of second bond surfaces, each of which is parallel with each other at varying elevations relative to the z-axis thereof. The second bond surfaces are arranged to align with the first bond surfaces in complementing relation such that the lower structure is joined with the upper structure at the first and second bond surfaces. The assembly further comprises an adhesive disposed between the first and second bond surfaces to join the lower and upper structures at the first and second bond surfaces, defining a bond gap between the first and second bond surfaces.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: August 15, 2023
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Balbir Singh Sangha, Len V. Peschansky, Manish Pamwar, Fred M. Marquardt, William R. Rodgers, Bruce N. Greve, David Kennedy, Adrian Bica, Bikramjit Sarkaria
  • CHASSIS ASSEMBLY HAVING MIXED MATERIALS
    Publication number: 20230110672
    Abstract: A chassis assembly having mixed material for reduced mass is provided. The assembly comprises an upper structure comprised of metal. The upper structure has a plurality of first bond surfaces, each of which is parallel with each other at varying elevations relative to a z-axis of a 3-dimensional coordinate thereof. The assembly further comprises a lower structure made of a polymer composite. The lower structure has a plurality of second bond surfaces, each of which is parallel with each other at varying elevations relative to the z-axis thereof. The second bond surfaces are arranged to align with the first bond surfaces in complementing relation such that the lower structure is joined with the upper structure at the first and second bond surfaces. The assembly further comprises an adhesive disposed between the first and second bond surfaces to join the lower and upper structures at the first and second bond surfaces, defining a bond gap between the first and second bond surfaces.
    Type: Application
    Filed: October 13, 2021
    Publication date: April 13, 2023
    Inventors: Balbir Singh Sangha, Len V. Peschansky, Manish Pamwar, Fred M. Marquardt, William R. Rodgers, Bruce N. Greve, David Kennedy, Adrian Bica, Bikramjit Sarkaria