Patents by Inventor Manish Ranjan

Manish Ranjan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8301396
    Abstract: Theory and design of a new electrical-mobility based instrument for measurement of aerosol particle size distributions in real time is presented. Miniature Electrical Aerosol Spectrometer has a rectangular cross-section with two main regions: the Electrostatic Precipitator (ESP) and Classifier sections. The ESP section enables charged particle injection into the classifier section in a narrow range of streamlines at the desired location. The injected charged particles are then segregated based on their electrical mobility in the classifier section and collected on a series of plates that are connected to electrometers. Real-time particle size distribution measurements can be inferred from the electrometer signal strengths with the knowledge of the instrument transfer function.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: October 30, 2012
    Assignee: Clarkson University
    Inventors: Suresh Dhanijala, Manish Ranjan
  • Patent number: 8299446
    Abstract: Sub-field enhanced global alignment (SEGA) methods for aligning reconstituted wafers in a lithography process are disclosed. The SEGA methods provide the ability to accommodate chip placement errors for chips supported by a reconstituted wafer when performing a lithographic process having an overlay requirement. The SEGA methods include measuring chip locations to determine sub-fields of the reconstituted wafer over which enhanced global alignment (EGA) can be performed on the chips therein to within the overlay requirement. The SEGA methods further included individually performing EGA over the respective sub-fields. The SEGA methods take advantage of the benefits of both EGA and site-by-site alignment and are particularly applicable to wafer-level packing lithographic processes such as fan-out wafer-level packaging.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: October 30, 2012
    Assignee: Ultratech, Inc.
    Inventors: Andrew M. Hawryluk, Emily True, Manish Ranjan, Warren Flack, Detlef Fuchs
  • Publication number: 20120229782
    Abstract: A lithographic apparatus includes a substrate table constructed to hold a substrate, a projection system configured to project a patterned radiation beam through an opening and onto a target portion of the substrate, and a conduit having an outlet in the opening. The conduit is configured to deliver gas to the opening. The lithographic apparatus further includes a cooling apparatus controlled by a control system. The cooling apparatus is configured to cool the gas such that gas which travels from the opening to the substrate has a predetermined temperature when the gas is incident upon the substrate.
    Type: Application
    Filed: February 29, 2012
    Publication date: September 13, 2012
    Applicant: ASML Netherlands B.V.
    Inventors: Han-Kwang Nienhuys, Martinus Anges Willem Cuijpers, Leon Martin Levasier, Jan Bernard Plechelmus Van Schoot, Yuri Johannes Gabriël Van De Vijver, Oleg Viacheslavovich Voznyi, Franciscus Johannes Joseph Janssen, Danny Maria Hubertus Philips, Marcio Alexandre Cano Miranda, Olesksiy Galaktionov, Manish Ranjan, Albert Pieter Rijpma, Kursat Bal, Roger Wilhelmus Antonius Henricus Schmitz, Alain Louis Claude Leroux
  • Publication number: 20120229783
    Abstract: A lithographic apparatus includes a substrate table constructed to hold a substrate, a projection system configured to project a patterned radiation beam through an opening and onto a target portion of the substrate, and a conduit having an outlet in the opening. The conduit is configured to deliver gas to the opening. The lithographic apparatus further includes a cooling apparatus controlled by a control system. The cooling apparatus is configured to cool the gas such that gas which travels from the opening to the substrate has a predetermined temperature when the gas is incident upon the substrate.
    Type: Application
    Filed: March 1, 2012
    Publication date: September 13, 2012
    Applicant: ASML Netherlands B.V.
    Inventors: Han-Kwang Nienhuys, Martinus Agnes Willem Cuijpers, Nicolaas Ten Kate, Leon Martin Levasier, Jan Bernard Plechelmus Van Schoot, Yuri Johannes Gabriël Van De Vijver, Oleg Viacheslavovich Voznyi, Franciscus Johannes Joseph Janssen, Danny Maria Hubertus Philips, Marcio Alexandre Cano Miranda, Oleksiy Galaktionov, Manish Ranjan, Albert Pieter Rijpma, Kursat Bal, Laurentius Johannes Adrianus Van Bokhoven, Roger Wilhelmus Antonius Henricus Schmitz, Alain Louis Claude Leroux