Abstract: A sensor package is provided. The sensor package includes, but not limited to: a mounting adaptor defining a housing and a port channel connecting with the housing; a sensor assembly positioned in the housing and including a sensing element to sense an ambient environment; a potting material deposited within the housing to encapsulate the sensor assembly; and a locking mechanism positioned in the port channel and configured to clip with the mounting adaptor to prevent seepage of the potting material.

Abstract: An example coupling mechanism for a media-isolated pressure sensor, method for manufacturing the coupling mechanism, and media-isolated pressure sensor are provided. The coupling mechanism includes a fluid coupling medium disposed in an interior cavity of a pressure sensor housing, forming a barrier between pressure sensing circuitry and a fluid. Disposing the fluid coupling medium includes dispensing within the interior cavity, a first portion of a fluid coupling substance having a volume less than a maximum substance volume, and removing dissolved gas from within the first portion. Disposing the fluid coupling medium further includes dispensing a second portion of the fluid coupling substance within the interior cavity, the second portion also having a volume less than the maximum substance volume. The fluid coupling substance is cured, forming a coupling mechanism, such that pressure sensing circuitry generates electrical signals based on pressure imposed by the fluid through the coupling mechanism.

Abstract: Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

Abstract: Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.