Abstract: Provided is a manufacturing method for a solid-state image pickup device, which enables easily manufacturing a thin-type solid-state image pickup device at a wafer level. A support substrate is bonded to a cover glass substrate. A surface of the cover glass substrate on an opposite side to the support substrate is mechanically polished. A part of the support substrate is removed, and a plurality of frame-shaped spacers are formed on the cover glass substrate. The cover glass substrate is made thinner by wet etching so as to have a predetermined thickness. The cover glass substrate and a silicon wafer on which solid-state image pickup elements are formed are attached to each other via the spacers. The cover glass substrate is divided into individual pieces. The silicon wafer is divided into individual pieces. In this way, the solid-state image pickup device is manufactured.

Abstract: A method for manufacturing solid-state imaging device for collectively manufacturing a multiplicity of solid-state imaging devices at a wafer level, the method including: a step of reducing the thickness of a cover glass wafer (10) after providing a mask material (12) to the cover glass wafer (10) including frame-shaped spacers (5); a step of releasing the mask material (12) and laminating a first support wafer (14) through a lamination member (16); a step of positioning and bonding a silicon wafer (18) and the cover glass wafer (10), the silicon wafer (18) including a second support wafer (22) laminated on the back side through a lamination member (24); a step of dicing the cover glass wafer (10) into cover glasses (4) by a whetstone (26); and a step of dicing the silicon wafer (18) by a whetstone (28).

Abstract: In a method for cutting a solid-state image pickup device of the present invention, a glass cover plate is diced with a surface thereof being protected, so that chipping of the glass cover plate can be significantly prevented. In addition, since a CCD wafer is adhered after the glass cover plate is diced, no glass fragments scattered due to chipping of the glass cover plate touch the CCD wafer, or cause damage to the CCD wafer, thereby a cutting of solid-state image pickup device can be achieved with high accuracy and high quality.

Abstract: A method of producing a solid-state imaging device according to one embodiment of the present invention is characterized in that, in a method of producing a solid-state imaging device such that a solid-state imaging element wafer is bonded to a light transmissive substrate on one surface of which spacers are formed so as to surround solid-state imaging elements formed on the solid-state imaging element wafer and ditches are formed between the spacers to produce a bonded substrate and then the bonded substrate is divided correspondingly to the individual solid-state imaging elements, a support is bonded to the surface opposite to the surface of the light transmissive substrate on which the ditches are formed.

Abstract: A method for cutting a solid-state image pickup device with high accuracy and high quality is provided which does not cause any chipping and prevents damages to a wafer surface. A temporary bonding agent is coated to a back surface of a glass cover plate which is opposite to the surface having a spacer, and a transparent protective wafer having a surface to which an adhesive sheet having a reducible adhesive strength is attached is adhered to the surface of the glass cover plate to which the temporary bonding agent is coated, with the adhesive sheet facing to the glass cover plate surface. The adhered glass cover plate and protective wafer are cut from the surface of the glass cover plate to the temporary bonding agent. After a CCD wafer is bonded to the cut glass cover plate, the protective wafer, the adhesive sheet, and the temporary bonding agent are peeled off, and the CCD wafer is cut to obtain individual chips.

Abstract: A method of grinding a multilayer body which can prevent a substrate from being damaged by a broken piece of a planar substance, which occurs during grinding and cutting in grinding and cutting the planar substance of the multilayer substance constructed by the substrate and the planar substance which are joined with an extremely narrow gap portion therebetween is provided. A protection layer of the substrate is formed in the gap portion in advance and the substrate can be prevented from being damaged by the broken piece of the planar substance occurring by grinding, in grinding and cutting the planar substance by cutting into the gap portion with a grindstone, of the multilayer body in which the substrate and the planar substance are joined to have the gap portion therebetween.