Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator, a pushing member and a controller. The controller attracts a second substrate with a beginning attracting pressure distribution set on multiple regions, when a pressurization of a first substrate by the pushing member is begun. The controller performs a control of performing a switchover from the beginning attracting pressure distribution to a progress attracting pressure distribution between a time point when the pressurization by the pushing member is begun and a contact end point at which an entire bonding surface of the first substrate and an entire bonding surface of the second substrate come into contact with each other. The progress attracting pressure distribution is created by changing at least one attracting pressure of attracting pressures on the multiple regions in the beginning attracting pressure distribution.