Patents by Inventor Manoj C. Gambhirwala

Manoj C. Gambhirwala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Treatment for copper foil
    Patent number: 4572768
    Abstract: An improved treatment for copper foil that is to be used for lamination to a board comprises electrodepositing a dendritic layer of copper on the side of the foil that is to be laminated to the board. The dendritic layer is secured by electrodepositing a gilding layer of copper over it. A barrier layer is next electrodeposited over the gilding layer. The barrier layer is formed by means such as electrodeposition from a solution containing ions of zinc, nickel and antimony. This in turn is covered with an anticorrosion layer that is formed of chromates or phosphates, disposed over the barrier layer.
    Type: Grant
    Filed: June 28, 1985
    Date of Patent: February 25, 1986
    Assignee: Square D Company
    Inventors: Adam M. Wolski, Chintsai T. Cheng, Richard B. Simon, Manoj C. Gambhirwala