Abstract: This document relates to a process for supporting the management of a variety of types of deployed devices. Administrators utilizing enterprise services can provide generic configuration data using configuration templates, which can be provided to a management server. The management server can then precompute device-specific configuration settings and resolve any conflicts that may arise based on the configuration templates. The configuration templates can also include placeholders for secret values, and once a managed device checks in to the management server, the secret values can be retrieved from an applicable enterprise service and provided to the managed device at the time of applying the configuration template.

Abstract: This document relates to a process for supporting the management of a variety of types of deployed devices. Administrators utilizing enterprise services can provide generic configuration data using configuration templates, which can be provided to a management server. The management server can then precompute device-specific configuration settings and resolve any conflicts that may arise based on the configuration templates. The configuration templates can also include placeholders for secret values, and once a managed device checks in to the management server, the secret values can be retrieved from an applicable enterprise service and provided to the managed device at the time of applying the configuration template.

Abstract: An information handling system includes a radio connected to an antenna subsystem, and a proximity sensor configured to detect a proximity of a user to the antenna subsystem. An antenna controller may identify an antenna physical configuration of an antenna subsystem, retrieve a power table corresponding to the antenna physical configuration, transmit the power table to the radio via a direct communication interface between the antenna controller and the radio, and communicate a message to the radio, the message in response to the proximity of the user to the antenna subsystem. The radio may set a radio transmit power level in response to the message.

Abstract: An information handling system (IHS) includes an antenna system. The antenna system includes a smart antenna and a smart antenna control system, the smart antenna control system controlling configuration of a configurable aspect of the smart antenna based upon information regarding the configurable aspect of the smart antenna.

Abstract: This document relates to a process for supporting the management of a variety of types of deployed devices. Administrators utilizing enterprise services can provide generic configuration data using configuration templates, which can be provided to a management server. The management server can then precompute device-specific configuration settings and resolve any conflicts that may arise based on the configuration templates. The configuration templates can also include placeholders for secret values, and once a managed device checks in to the management server, the secret values can be retrieved from an applicable enterprise service and provided to the managed device at the time of applying the configuration template.

Abstract: This document relates to a process for supporting the management of a variety of types of deployed devices. Administrators utilizing enterprise services can provide generic configuration data using configuration templates, which can be provided to a management server. The management server can then precompute device-specific configuration settings and resolve any conflicts that may arise based on the configuration templates. The configuration templates can also include placeholders for secret values, and once a managed device checks in to the management server, the secret values can be retrieved from an applicable enterprise service and provided to the managed device at the time of applying the configuration template.

Abstract: An information handling system (IHS) includes an antenna system. The antenna system includes a smart antenna and a smart antenna control system, the smart antenna control system controlling configuration of a configurable aspect of the smart antenna based upon information regarding the configurable aspect of the smart antenna.

Abstract: A trench capacitor includes a plurality of trenches in a semiconductor substrate. A first polysilicon layer is located within the plurality of trenches and over a top surface of the substrate. The first polysilicon layer is continuous between the plurality of trenches. The trench capacitor further includes a plurality of second polysilicon layers. Each of the second polysilicon layers fills a corresponding trench of the plurality of trenches. The second polysilicon layers each extend to a top surface of the first polysilicon layer.

Abstract: This document relates to a process for supporting the management of a variety of types of deployed devices. Administrators utilizing enterprise services can provide generic configuration data using configuration templates, which can be provided to a management server. The management server can then precompute device-specific configuration settings and resolve any conflicts that may arise based on the configuration templates. The configuration templates can also include placeholders for secret values, and once a managed device checks in to the management server, the secret values can be retrieved from an applicable enterprise service and provided to the managed device at the time of applying the configuration template.

Abstract: This document relates to a process for deploying devices and automatically provisioning the devices to connect to a managed network upon powering on with minimal user involvement. Upon deployment of the device to an end point, a record can be established in a management server regarding the device, which can associate device specifications with a deployment profile to be used in provisioning the device. Upon powering on of the device at the end point, the device can automatically perform attestation with the management server, which can then provision the device according to the deployment profile without additional user intervention.

Abstract: A trench capacitor includes at least one epitaxial semiconductor surface layer on a semiconductor substrate having a doping level that is less than a doping level of the semiconductor substrate. A plurality of trenches are formed through at least one half of a thickness of the epitaxial semiconductor surface layer. The epitaxial semiconductor surface layer is thicker than a depth of the plurality of trenches. At least one capacitor dielectric layer lines a surface of the trenches. At least one trench fill layer on the dielectric layer fills the trenches.

Abstract: A trench capacitor includes a plurality of trenches in a semiconductor substrate. A first polysilicon layer is located within the plurality of trenches and over a top surface of the substrate. The first polysilicon layer is continuous between the plurality of trenches. The trench capacitor further includes a plurality of second polysilicon layers. Each of the second polysilicon layers fills a corresponding trench of the plurality of trenches. The second polysilicon layers each extend to a top surface of the first polysilicon layer.

Abstract: A trench capacitor includes at least one epitaxial semiconductor surface layer on a semiconductor substrate having a doping level that is less than a doping level of the semiconductor substrate. A plurality of trenches are formed through at least one half of a thickness of the epitaxial semiconductor surface layer. The epitaxial semiconductor surface layer is thicker than a depth of the plurality of trenches. At least one capacitor dielectric layer lines a surface of the trenches. At least one trench fill layer on the dielectric layer fills the trenches.

Abstract: A trench capacitor includes at least one epitaxial semiconductor surface layer on a semiconductor substrate having a doping level that is less than a doping level of the semiconductor substrate. A plurality of trenches are formed through at least one half of a thickness of the epitaxial semiconductor surface layer. The epitaxial semiconductor surface layer is thicker than a depth of the plurality of trenches. At least one capacitor dielectric layer lines a surface of the trenches. At least one trench fill layer on the dielectric layer fills the trenches.

Abstract: A trench capacitor includes a plurality of trenches in a doped semiconductor surface layer of a substrate. At least one dielectric layer lines a surface of the plurality of trenches. A second polysilicon layer that is doped is on a first polysilicon layer that is on the dielectric layer which fills the plurality of trenches. The second polysilicon layer has a higher doping level as compared to the first polysilicon layer.

Abstract: A trench capacitor includes at least one epitaxial semiconductor surface layer on a semiconductor substrate having a doping level that is less than a doping level of the semiconductor substrate. A plurality of trenches are formed through at least one half of a thickness of the epitaxial semiconductor surface layer. The epitaxial semiconductor surface layer is thicker than a depth of the plurality of trenches. At least one capacitor dielectric layer lines a surface of the trenches. At least one trench fill layer on the dielectric layer fills the trenches.

Abstract: A trench capacitor includes a plurality of trenches in a doped semiconductor surface layer of a substrate. At least one dielectric layer lines a surface of the plurality of trenches. A second polysilicon layer that is doped is on a first polysilicon layer that is on the dielectric layer which fills the plurality of trenches. The second polysilicon layer has a higher doping level as compared to the first polysilicon layer.

Abstract: An integrated circuit wafer and fabrication method includes a probe pad structure in saw lanes between integrated circuits. The probe pad structure includes a probe pad with a plurality of pad segments. The pad segments are elements of an interconnect level of the wafer.

Abstract: A closure system may secure a first bone portion to a second bone portion. The closure system may include a bracket, a band and a tensioning device. The bracket may include a first portion adapted to engage the first bone portion and a second portion adapted to engage the second bone portion. The band may engage the bracket and may be adapted to be looped around the first and second bone portions. The tensioning device may include a body and a threaded member. The threaded member may be received in the body and may engage the band such that rotation of the threaded member relative to the body moves a first end of the band relative to a second end of the band.

Abstract: An integrated circuit wafer and fabrication method includes a probe pad structure in saw lanes between integrated circuits. The probe pad structure includes a probe pad with a plurality of pad segments. The pad segments are elements of an interconnect level of the wafer.