Abstract: A heat transfer fluid can be used as part of a multi-phase adsorption environment to allow for improved separations of gas components using a solid adsorbent. The heat transfer fluid can reduce or minimize the temperature increase of the solid adsorbent that occurs during an adsorption cycle. Reducing or minimizing such a temperature increase can enhance the working capacity for an adsorbent and/or enable the use of adsorbents that are not practical for commercial scale adsorption using conventional adsorption methods. The multi-phase adsorption environment can correspond to a trickle bed environment, a slurry environment, or another convenient environment where at least a partial liquid phase of a heat transfer fluid is present during gas adsorption by a solid adsorbent.

Abstract: A heat transfer fluid can be used as part of a multi-phase adsorption environment to allow for improved separations of gas components using a solid adsorbent. The heat transfer fluid can reduce or minimize the temperature increase of the solid adsorbent that occurs during an adsorption cycle. Reducing or minimizing such a temperature increase can enhance the working capacity for an adsorbent and/or enable the use of adsorbents that are not practical for commercial scale adsorption using conventional adsorption methods. The multi-phase adsorption environment can correspond to a trickle bed environment, a slurry environment, or another convenient environment where at least a partial liquid phase of a heat transfer fluid is present during gas adsorption by a solid adsorbent.

Abstract: A fibrillar structure and a method of making it. The structure comprises a backing layer, a plurality of fibrils and a contacting region. The method of making it comprises constructing a synthetic fibrillar array, preparing a liquid material on a substrate and contacting the fibrillar array with the liquid material.

Abstract: Polyorganosiloxane compositions yielding cured elastomers exhibiting cohesive bonding to inorganic substrates contain as the adhesion promoter the combination of (1) a 1,2- bis(trialkoxysilyl)ethane of the general formula (RO).sub.3 SiCH.sub.2 CH.sub.2 Si(OR).sub.3 where R represents an alkyl or haloalkyl radical containing from 1 to 8 carbon atoms, (2) an organosilicon compound containing at least one hydroxyl group or a hydrolyzable precursor thereof and at least one group that reacts at ambient temperature with the alkoxy groups of the silylethane or with the curable polyorganosiloxane composition, and (3) a catalyst for the reaction of the adhesion promoter ingredients.Preferred compositions are cured at room temperature by a platinum catalyzed hydrosilation reaction and are applied to metallic substrates that have not been cleaned or otherwise treated prior to application of the composition.