Patents by Inventor Manoj KADADE

Manoj KADADE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190043817
    Abstract: The present disclosure provides packages and methods for fabricating packages. A package may comprise a wafer-level package (WLP) layer comprising a WLP contact and a component within the WLP layer associated with a component depth. A conductive pillar is disposed on the WLP contact and comprises an opposite surface that forms an array pad. The package further comprises a mold over the WLP layer and at least partially surrounding the conductive pillar, wherein the mold compound and the array pad form a substantially planar land grid array (LGA) contact surface that is configured to couple the package to a land grid array. The LGA contact surface has a height that is equal to a selected LGA component height, and the selected LGA component height is equal to a difference between a keepout distance associated with a characteristic of the component within the WLP layer and the component depth.
    Type: Application
    Filed: September 14, 2018
    Publication date: February 7, 2019
    Inventors: Manoj KADADE, Haiyong XU, Ruey Kae ZANG, Yue LI, Xiaonan ZHANG, Christine HAU-RIEGE