Abstract: The present disclosure provides packages and methods for fabricating packages. A package may comprise a wafer-level package (WLP) layer comprising first and second WLP contacts and first and second conductive pillars disposed on the first and second WLP contacts. Each conductive pillar may comprise a surface opposite the WLP contact that forms an array pad. The array pads may have different sizes. The package may further comprise a mold over the WLP layer and at least partially surrounding the conductive pillars, wherein the mold compound and the first array pads form a substantially planar LGA contact surface that is configured to couple the package to a land grid array.