Abstract: A fuel boost pump assembly for an aircraft includes a first inlet for receiving a first pressurized fuel flow, a second inlet, an assembly outlet, a pump for transferring fuel between the second inlet and the assembly outlet, and a hydraulic motor adapted to drive the pump. The hydraulic motor is fluidly connected between the first inlet and the assembly outlet, and is mechanically coupled to the pump. Further, in use, the hydraulic motor converts hydraulic energy of the first pressurized fuel flow into driving energy of the pump such that the pump generates a second pressurized fuel flow between the second inlet and the assembly outlet.

Abstract: The present disclosure provides packages and methods for fabricating packages. A package may comprise a wafer-level package (WLP) layer comprising first and second WLP contacts and first and second conductive pillars disposed on the first and second WLP contacts. Each conductive pillar may comprise a surface opposite the WLP contact that forms an array pad. The array pads may have different sizes. The package may further comprise a mold over the WLP layer and at least partially surrounding the conductive pillars, wherein the mold compound and the first array pads form a substantially planar LGA contact surface that is configured to couple the package to a land grid array.