Abstract: An example apparatus comprises memory, first instructions, and programmable circuitry to be programmed by the first instructions to associate a first portion of metadata with a first category, the metadata corresponding to a cloud resource of a cloud account, associate a second portion of the metadata with a second category, and determine a template based on the first portion being greater than the second portion, the template associated with the first category, the template including second instructions to define a target state to be enforced on the cloud account.

Abstract: An integrated circuit device (100) and method comprising an IC chip (102) having metal interconnect levels (M1-Mn) including a last copper interconnect level (Mn) and a chip-to-package interconnect (110) overlying and connected to the last copper interconnect level (Mn). The chip-to-package interconnect (110) having a via (112) connected to a first element (306a) of the last copper interconnect level (Mn) and a copper conductive structure (118) (e.g., bump copper). The via (112) includes a barrier material (112a) and a tungsten fill layer (112b), the via coupled between the copper conductive structure (118) and the first element (306a).

Abstract: An embodiment semiconductor structure includes a metal layer. The semiconductor structure also includes a redistribution layer (RDL) structure including an RDL platform and a plurality of RDL pillars disposed between the RDL platform and the metal layer. Additionally, the semiconductor structure includes an under-bump metal (UBM) layer disposed on the RDL platform and a solder bump disposed on the UBM layer, where the UBM layer, the RDL platform, and the RDL pillars form an electrical connection between the solder bump and the metal layer.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed that monitor and correct for configuration drift in cloud accounts by instantiating or executing machine-readable instructions to access target state configuration information from a first user account for a cloud account, onboard the cloud account at a first time to configure cloud resources based on the target state configuration information, detect a first drift between the target state configuration information and an in-use configuration state of the cloud account at a second time, log a corresponding change in the in-use configuration state relative to the target state configuration information, the first event record logged in a timeline of second event records representing second drifts of the cloud account relative to the target state configuration information, and after the detection of the first drift, change an in-use configuration of the cloud account based on the target state configuration information.

Abstract: An embodiment semiconductor structure includes a metal layer. The semiconductor structure also includes a redistribution layer (RDL) structure including an RDL platform and a plurality of RDL pillars disposed between the RDL platform and the metal layer. Additionally, the semiconductor structure includes an under-bump metal (UBM) layer disposed on the RDL platform and a solder bump disposed on the UBM layer, where the UBM layer, the RDL platform, and the RDL pillars form an electrical connection between the solder bump and the metal layer.

Abstract: A method of forming a semiconductor device with a metal pillar overlapping a first top metal interconnect and a second top metal interconnect is disclosed. The metal pillar overlapping the first top metal interconnect and second top metal interconnect is connected to the first top metal interconnect by top metal vias while the second top metal interconnect does not contain top metal vias and remains free of a direct electrical connection to the metal pillar. The metal pillars are attached directly to top metal vias without a bond pad of metal. The elimination of the bond pad layer reduces the mask count, processing, and cost of the device. In addition, the elimination of the bond pad results in reduced die area requirements for the metal pillar.

Abstract: A propulsion system including a casing surrounding a fan rotor assembly is provided. An example casing includes an outer layer material, an inner layer material including first openings extended partially through the inner layer material along a radial direction of a first side of the inner layer material, and second openings extended partially through the inner layer material along the radial direction of a second side of the inner layer material opposite the first side, and a spring member coupled to the outer layer material and the inner layer material.

Abstract: A method of forming a semiconductor device with a metal pillar overlapping a first top metal interconnect and a second top metal interconnect is disclosed. The metal pillar overlapping the first top metal interconnect and second top metal interconnect is connected to the first top metal interconnect by top metal vias while the second top metal interconnect does not contain top metal vias and remains free of a direct electrical connection to the metal pillar. The metal pillars are attached directly to top metal vias without a bond pad of metal. The elimination of the bond pad layer reduces the mask count, processing, and cost of the device. In addition, the elimination of the bond pad results in reduced die area requirements for the metal pillar.

Abstract: Walls of gas turbine engine casings, fan cases, and methods for forming walls, e.g., fan case walls, are provided. For example, a wall comprises a plurality of composite plies arranged in a ply layup. The wall is annular and circumferentially segmented into a plurality of regions that include at least one first region and at least one second region. The ply layup in the first and second regions is different such that the ply layup is non-axisymmetric. An exemplary fan case comprises an annular inner shell, a filler layer, an annular back sheet, and an annular outer layer. The back sheet is circumferentially segmented into a plurality of regions, including at least one first region and at least one second region, and comprises a plurality of composite plies arranged in a ply layup that is different in the first and second regions such that the ply layup is non-axisymmetric.

Abstract: A platform for use between adjacent propulsion rotor airfoils joined to a rotor disk to provide an inner flowpath boundary includes: an axially extending I-beam supporting a radially outer skin having a flowpath surface; the I-beam including an inner I-flange disposed at an inner edge of an axially extending I-web, and an outer I-flange disposed at an outer edge of the I-web; the I-beam including a laterally-extending forward end flange at a forward end of the I-web, and a laterally-extending aft end flange at an aft end of the I-web; and the radially outer skin disposed on top of and joined to the radially outer I-flange such that the forward end flange and the aft end flange abut the outer skin.

Abstract: A softwall containment system for a machine includes an inner wall circumscribing a bladed rotatable member of the machine and extending from a forward end to an aft end. The softwall containment system also includes an outer wall circumscribing the inner wall and extending from a forward end to an aft end. The outer wall is spaced radially outwardly from the inner wall. The outer wall extends axially between a first joint coupling the forward end of the inner wall to the forward end of the outer wall and a second joint coupling the aft end of the inner wall to the aft end of the outer wall. The softwall containment system also includes an anti-ballistic material wrap covering the outer wall, the anti-ballistic material wrap including at least one of a first extension extending forward of the first joint and a second extension extending aft of the second joint.

Abstract: An integrated circuit device (100) and method comprising an IC chip (102) having metal interconnect levels (M1-Mn) including a last copper interconnect level (Mn) and a chip-to-package interconnect (110) overlying and connected to the last copper interconnect level (Mn). The chip-to-package interconnect (110) having a via (112) connected to a first element (306a) of the last copper interconnect level (Mn) and a copper conductive structure (118) (e.g., bump copper). The via (112) includes a barrier material (112a) and a tungsten fill layer (112b), the via coupled between the copper conductive structure (118) and the first element (306a).

Abstract: A bolted joint apparatus includes: a first component including a first row of first bolt holes extending therethrough; a second component including a second row of second bolt holes extending therethrough wherein the second bolt holes are aligned coaxially with the first bolt holes, a plurality of fasteners, each of fasteners disposed through aligned pairs of the first and second bolt holes to couple together the first and second components, each of the fasteners including a shank; and crushable spacers disposed around the shanks of the fasteners, the crushable spacers clamped in compression between the fasteners and one of the components, wherein each of the crushable spacers has a tubular body interconnecting first and second enlarged ends, the tubular body being defined by a peripheral wall which incorporates at least one weakening feature.

Abstract: A propulsion system including a casing surrounding a fan rotor assembly is provided. An example casing includes an outer layer material, an inner layer material including first openings extended partially through the inner layer material along a radial direction of a first side of the inner layer material, and second openings extended partially through the inner layer material along the radial direction of a second side of the inner layer material opposite the first side, and a spring member coupled to the outer layer material and the inner layer material.

Abstract: A propulsion system including a casing surrounding a fan rotor assembly is provided. The casing includes an outer layer material defining a first coefficient of thermal expansion (CTE) and an inner layer material. The casing further includes a spring member disposed between the outer layer material and the inner layer material coupling the outer layer material and the inner layer material. The spring member is coupled to each of the outer layer material and the inner layer material within a flow passage defined between the outer layer material and the inner layer material. The spring member defines a second CTE greater than the first CTE.

Abstract: A containment structure for surrounding a rotatable machine includes a double-walled inner shell having a forward end, an aft end, and a substantially cylindrical body extending therebetween. The inner shell includes an inner wall at least partially surrounding a bladed portion of the bladed rotor, and an outer portion that branches radially outward from the inner wall. The containment structure also includes a substantially cylindrical back sheet coupled to the outer portion and disposed radially outward of the inner wall.

Abstract: A bolted joint apparatus includes: a first component including a first row of first bolt holes extending therethrough; a second component including a second row of second bolt holes extending therethrough wherein the second bolt holes are aligned coaxially with the first bolt holes, a plurality of fasteners, each of fasteners disposed through aligned pairs of the first and second bolt holes to couple together the first and second components, each of the fasteners including a shank; and crushable spacers disposed around the shanks of the fasteners, the crushable spacers clamped in compression between the fasteners and one of the components, wherein each of the crushable spacers has a tubular body interconnecting first and second enlarged ends, the tubular body being defined by a peripheral wall which incorporates at least one weakening feature.

Abstract: A platform for use between adjacent propulsion rotor airfoils joined to a rotor disk to provide an inner flowpath boundary includes: an axially extending I-beam supporting a radially outer skin having a flowpath surface; the I-beam including an inner I-flange disposed at an inner edge of an axially extending I-web, and an outer I-flange disposed at an outer edge of the I-web; the I-beam including a laterally-extending forward end flange at a forward end of the I-web, and a laterally-extending aft end flange at an aft end of the I-web; and the radially outer skin disposed on top of and joined to the radially outer I-flange such that the forward end flange and the aft end flange abut the outer skin.

Abstract: A propulsion system including a casing surrounding a fan rotor assembly is provided. The casing includes an outer layer material defining a first coefficient of thermal expansion (CTE) and an inner layer material. The casing further includes a spring member disposed between the outer layer material and the inner layer material coupling the outer layer material and the inner layer material. The spring member is coupled to each of the outer layer material and the inner layer material within a flow passage defined between the outer layer material and the inner layer material. The spring member defines a second CTE greater than the first CTE.

Abstract: Walls of gas turbine engine casings, fan cases, and methods for forming walls, e.g., fan case walls, are provided. For example, a wall comprises a plurality of composite plies arranged in a ply layup. The wall is annular and circumferentially segmented into a plurality of regions that include at least one first region and at least one second region. The ply layup in the first and second regions is different such that the ply layup is non-axisymmetric. An exemplary fan case comprises an annular inner shell, a filler layer, an annular back sheet, and an annular outer layer. The back sheet is circumferentially segmented into a plurality of regions, including at least one first region and at least one second region, and comprises a plurality of composite plies arranged in a ply layup that is different in the first and second regions such that the ply layup is non-axisymmetric.