Abstract: An integrated circuit includes a stacked conductive layer interposer and a first die at least partially encapsulated in a mold material. The first die is mechanically and electrically attached to a top surface of the stacked conductive layer interposer using solder bumps. The integrated circuit further includes a first warpage correction layer.

Abstract: A PV receiver that, when located within a solar concentrator, provides for shielding of electrical connections associated with the receiver from solar radiation that is reflected toward the receiver. The PV receiver comprises an electrically non-conductive elongate carrier, and a plurality of PV wafer dice mounted as a linear array to a first, forward, face of the carrier. A plurality of conductor elements is arrayed along the first face of the carrier behind the PV wafer dice and the conductor elements are connected one-to-one with electrodes located on a first, rearward, face of each of the wafer dice. Busbars are located on the elongate carrier behind the PV wafer dice, and electrically conductive connections made between the conductor elements and the busbars behind the PV wafer dice. In one embodiment of the PV receiver the busbars are located on a second, rearward, face of the carrier and the electrically conductive connections are made through the carrier.