Patents by Inventor Manoj Nagulapally

Manoj Nagulapally has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip module package compact thermal models
    Patent number: 10409358
    Abstract: The current subject matter provides for the generation of network models for multi-chip module packages that are a combination of compact models for each chip within such packages. In some variations, a combination of single chip extraction methods and a linear superposition technique can be used to predict junction temperatures of MCM packages. Related methods, systems, apparatus, and articles are also described.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: September 10, 2019
    Assignee: Ansys, Inc.
    Inventors: Vamsi Krishna Yaddanapudi, Ankit R. Adhiya, Aniket A. Kulkarni, Manoj Nagulapally