Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.

Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.

Abstract: Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.

Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.

Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

Abstract: A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.

Abstract: A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.