Patents by Inventor Manolo Mena

Manolo Mena has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packages and methods for packaging
    Patent number: 9142470
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: September 22, 2015
    Assignee: ANALOG DEVICES, INC.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
  • PACKAGES AND METHODS FOR PACKAGING
    Publication number: 20140332947
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 13, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
  • Packages and methods for packaging using a lid having multiple conductive layers
    Patent number: 8723308
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: May 13, 2014
    Assignee: Analog Devices, Inc.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Rick Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
  • PACKAGES AND METHODS FOR PACKAGING
    Publication number: 20120126347
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Application
    Filed: November 17, 2011
    Publication date: May 24, 2012
    Applicant: ANALOG DEVICES, INC.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
  • Method of producing a MEMS device
    Publication number: 20060027522
    Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
    Type: Application
    Filed: August 9, 2004
    Publication date: February 9, 2006
    Inventors: John Martin, Manolo Mena, Elmer Lacsamana, Michael Duffy, William Webster, Lawrence Felton, Maurice Karpman