Patents by Inventor Manoru Mita

Manoru Mita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same
    Publication number: 20070034519
    Abstract: On both surfaces of an electric insulating material 1, a surface conductive layer 2A and a back surface conductive layer 2B are formed by transcription. Further, a via hole 5 penetrating through the surface conductive layer 2A and the electric insulating material 1 is provided. After forming a photosensitive plating resist pattern 14, the via hole 5 is filled with a copper plating filler 15, and the surface wiring layer 9A and the back surface wiring layer 9B are formed. Thereafter, the photosensitive plating resist pattern 14 as well as the surface conductive layer 2A and the back surface conductive layer 2B provided under the photosensitive plating resist pattern 14 are removed to fabricate a double-sided wiring board 11.
    Type: Application
    Filed: October 10, 2006
    Publication date: February 15, 2007
    Applicant: HITACHI CABLE, LTD.
    Inventors: Akira Chinda, Nobuaki Miyamoto, Manoru Mita