Abstract: Systems and methods of independent thermal control of devices under test (DUTs) (e.g., memory devices) are disclosed herein. DUTs are coupled to dedicated cooling channels that include one or more controllable fans. The fans can be controlled independently according to temperature information of the DUTs, which is typically measured by an internal temperature sensor disposed in the DUTs. The fans of the cooling channels can be top-mounted (e.g., downdraft), bottom-mounted (e.g., updraft), or mounted on the front side of a DUT. Each cooling channel also has an exhaust channel on the front, top, and/or bottom of the channel for releasing heat. Advantageously, the air in the channel is guided by a shroud or cover placed over the DUT that can include internal vectored louvres, ridges, fins, ducts, chambers, etc., for directing air across surfaces of the DUT to evenly and efficiently cool the DUT during testing.

Abstract: Systems and methods of independent thermal control of devices under test (DUTs) (e.g., memory devices) are disclosed herein. DUTs are coupled to dedicated cooling channels that include one or more controllable fans. The fans can be controlled independently according to temperature information of the DUTs, which is typically measured by an internal temperature sensor disposed in the DUTs. The fans of the cooling channels can be top-mounted (e.g., downdraft), bottom-mounted (e.g., updraft), or mounted on the front side of a DUT. Each cooling channel also has an exhaust channel on the front, top, and/or bottom of the channel for releasing heat. Advantageously, the air in the channel is guided by a shroud or cover placed over the DUT that can include internal vectored louvres, ridges, fins, ducts, chambers, etc., for directing air across surfaces of the DUT to evenly and efficiently cool the DUT during testing.