Patents by Inventor Mansheng Wang

Mansheng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic aluminum laminate and thermally conductive adhesive therefor
    Patent number: 5490895
    Abstract: A 51/2" by 53/4" flat ceramic board is bonded to an aluminum frame which serves as a heat sink. The bonding agent intermediate the board and the frame is thermally conductive and comprises an epoxy containing Master Bond EP21TDCAOHT. The formed laminate or bond is capable of withstanding repeated stresses occurring through thermal cycling in temperatures from -60 degrees centigrade to +125 degrees centigrade and vibration and humidity testing.
    Type: Grant
    Filed: March 14, 1994
    Date of Patent: February 13, 1996
    Assignee: TRW Inc.
    Inventors: Mansheng Wang, Bruce A. Given
  • Ceramic aluminum laminate and thermally conductive adhesive therefor
    Patent number: 5180625
    Abstract: A 51/2" by 53/4" flat ceramic board is bonded to an aluminum frame which serves as a heat sink. The bonding agent intermediate the board and the frame is thermally conductive and comprises an epoxy containing Master Bond EP21TDCAOHT. The formed laminate or bond is capable of withstanding repeated stresses occurring through thermal cycling in temperatures from -60 degrees centigrade to +125 degrees centigrade and vibration and humidity testing.
    Type: Grant
    Filed: June 21, 1990
    Date of Patent: January 19, 1993
    Assignee: TRW Inc.
    Inventors: Mansheng Wang, Bruce A. Given