Patents by Inventor Manu A. Prakuzhy

Manu A. Prakuzhy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Spot-solderable leads for semiconductor device packages
    Patent number: 11430719
    Abstract: A semiconductor device that has at least one semiconductor chip attached to a leadframe made of sheet metal of unencumbered full thickness. The leadframe has leads of a first subset that alternate with leads of a second subset. The leads of the first and second subsets have elongated straight lead portions that are parallel to each other in a planar array. A cover layer of insulating material is located over portions of un-encapsulated lead surfaces. The portions of the leads of the first and second subsets that don't have the cover layer have a metallurgical configuration that creates an affinity for solder wetting.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: August 30, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Manu A. Prakuzhy, Siva P. Gurrum, Daryl R. Heussner, Stefan W. Wiktor, Ken Pham
  • Spot-Solderable Leads for Semiconductor Device Packages
    Publication number: 20190318983
    Abstract: A semiconductor device that has at least one semiconductor chip attached to a leadframe made of sheet metal of unencumbered full thickness. The leadframe has leads of a first subset that alternate with leads of a second subset. The leads of the first and second subsets have elongated straight lead portions that are parallel to each other in a planar array. A cover layer of insulating material is located over portions of un-encapsulated lead surfaces. The portions of the leads of the first and second subsets that don't have the cover layer have a metallurgical configuration that creates an affinity for solder wetting.
    Type: Application
    Filed: June 27, 2019
    Publication date: October 17, 2019
    Inventors: Manu A. Prakuzhy, Siva P. Gurrum, Daryl R. Heussner, Stefan W. Wiktor, Ken Pham