Abstract: A cooktop device, in particular an induction cooktop device, includes a base component and an articulated arm having a first arm part and a second arm part, with the articulated arm bearing exactly one heating element. A joint supports the second arm part for movement relative to the first arm part, and a suspension connects the first arm part to the base component.

Abstract: A cooktop device, in particular an induction cooktop device, includes a base component and an articulated arm having a first arm part and a second arm part, with the articulated arm bearing exactly one heating element. A joint supports the second arm part for movement relative to the first arm part, and a suspension connects the first arm part to the base component.

Abstract: One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.

Abstract: A microswitch which is electrostatically actuated, which has a first open position and a second closed position in which said switch closes at least a contact line (30); the microswitch comprising a movable part (10) which has at least a first actuated portion (11) and a second contact portion (12), which are mechanically connected by means of at least a connection element (13); said contact line/s (30) being placed between said first and second portions; wherein in the rest position of the microswitch the actuated portion is at a first distance d1 from the contact line and the contact portion is at a second distance d2 from the contact line; wherein the operation of the microswitch is the following: the first actuated portion is actuated by at least an actuating electrode (20), and in response to said actuation and via the connection element (13) the second contact portion (12) is arranged to contact said contact line (30) reducing said second distance d2 to zero.

Abstract: One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.

Abstract: An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

Abstract: The present invention is related in general to a wafer-level packaging technique for micro-electro-mechanical systems (MEMS). A cap structure is provided encapsulating a MEMS element formed on a base substrate. A channel communicates etching holes provided on said cap structure, for the passage of an etching fluid to a chamber in which the MEMS element is housed. The holes are arranged in such a manner that they do not overlap, which allows the provision of a large number of etching holes above the MEMS element, but prevents a sealing material from reaching the MEMS element. The invention provides a low cost wafer-level packaging technique for MEMS devices, that reduces the total etching time of the sacrificial material and provides a reinforced protective cap structure for the MEMS package.

Abstract: A microswitch which is electrostatically actuated, which has a first open position and a second closed position in which said switch closes at least a contact line (30); the microswitch comprising a movable part (10) which has at least a first actuated portion (11) and a second contact portion (12), which are mechanically connected by means of at least a connection element (13); said contact line/s (30) being placed between said first and second portions; wherein in the rest position of the microswitch the actuated portion is at a first distance d1 from the contact line and the contact portion is at a second distance d2 from the contact line; wherein the operation of the microswitch is the following: the first actuated portion is actuated by at least an actuating electrode (20), and in response to said actuation and via the connection element (13) the second contact portion (12) is arranged to contact said contact line (30) reducing said second distance d2 to zero.

Abstract: The invention, which relates to an electronic component with a semiconductor chip, which is connected to a carrier substrate and surrounded by a housing, is based on presenting a substrate-based, housed electronic component, which enables the continuous release of the internal vapor pressure arising when the electronic component is heated, and at the same time can be produced inexpensively using the known and tried-and-tested methods and materials. According to embodiments of the invention, this is achieved by virtue of the fact that the carrier substrate comprises a plurality of hollow vias open on both sides, which vias are distributed areally in at least one section of the carrier substrate that is covered by the housing.

Abstract: A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.

Abstract: A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.

Abstract: The invention, which relates to an electronic component with a semiconductor chip, which is connected to a carrier substrate and surrounded by a housing, is based on presenting a substrate-based, housed electronic component, which enables the continuous release of the internal vapor pressure arising when the electronic component is heated, and at the same time can be produced inexpensively using the known and tried-and-tested methods and materials. According to embodiments of the invention, this is achieved by virtue of the fact that the carrier substrate comprises a plurality of hollow vias open on both sides, which vias are distributed areally in at least one section of the carrier substrate that is covered by the housing.

Abstract: An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

Abstract: A packaged electronic component includes a substrate with an upper layer, a lower layer and a middle layer between the upper layer and the lower layer. The middle layer is formed from a first material that is more flexible than the material of the upper layer and the material of the lower layer. An electronic component, such as a semiconductor chip, can be adhered over the upper layer of the substrate. Solder balls can be adhered over the lower layer of the substrate.

Abstract: An arrangement increases the reliability of substrate-based Ball-Grid-Array (BGA) packages, with a die (chip) that is mounted on a substrate and electrically connected to interconnects of the substrate and for which the substrate is provided with solder balls arranged in a predetermined grid. The arrangement is particularly simple to realize and effective for increasing the reliability of substrate-based Ball-Grid-Array packages. This is achieved by a laminate layer provided with openings for receiving the solder balls at the positions of ball pads being laminated on the side of the substrate that is provided with the interconnects.