Patents by Inventor Manuel EIBL

Manuel EIBL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate handling device for a wafer
    Patent number: 12261075
    Abstract: The invention relates to a substrate handling device for a wafer, a substrate handling system for a wafer and a method for substrate handling. The substrate handling device comprises: —an end effector, —a straightening ring, and —a suction cup. The suction cup is arranged within the straightening ring. At least the straightening ring is releasably attached to the end effector. A first part of the suction cup is connectable to a vacuum supply and a second part of the suction cup is attachable to a substrate by means of reduced pressure provided by the vacuum supply. The suction cup projects from the straightening ring in a normal pressure state. The suction cup is on the same level as the straightening ring in a reduced pressure state, in which the substrate is held by the suction cup, so that the straightening ring contacts the substrate.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: March 25, 2025
    Assignee: SEMSYSCO GMBH
    Inventors: Andreas Gleissner, Manuel Eibl, Herbert Oetzlinger
  • SUBSTRATE HANDLING DEVICE FOR A WAFER
    Publication number: 20220262668
    Abstract: The invention relates to a substrate handling device for a wafer, a substrate handling system for a wafer and a method for substrate handling. The substrate handling device comprises: —an end effector, —a straightening ring, and —a suction cup. The suction cup is arranged within the straightening ring. At least the straightening ring is releasably attached to the end effector. A first part of the suction cup is connectable to a vacuum supply and a second part of the suction cup is attachable to a substrate by means of reduced pressure provided by the vacuum supply. The suction cup projects from the straightening ring in a normal pressure state. The suction cup is on the same level as the straightening ring in a reduced pressure state, in which the substrate is held by the suction cup, so that the straightening ring contacts the substrate.
    Type: Application
    Filed: July 30, 2020
    Publication date: August 18, 2022
    Inventors: Andreas GLEISSNER, Manuel EIBL, Herbert OETZLINGER