Abstract: A device for measuring a deformation, the device including a deformable body and a strain gauge, the strain gauge including a support in contact with the deformable body and a metallic resistive member in contact with the support, the resistive member having a resistance that varies with a deformation of the deformable body, the support being electrically insulating, porous and being made of at least one support material including at least one refractory, optionally hydrated, ceramic compound.

Abstract: The invention relates to a system for assisted ascent or descent, comprising: —a staircase comprising at least one instrumented mobile step, equipped with at least one sensor for measuring the centre of pressure of a user and at least one lifting actuator designed to raise or lower the step according to a degree of vertical freedom; —a calculation unit connected to the sensor for measuring the centre of pressure and to the lifting actuator, the calculation unit being configured to calculate at least the position, the speed of movement and the acceleration of the user from the centre of pressure measured by the sensor and, depending on the values calculated, control the lifting actuator.

Abstract: A bellows including a cylindrical and corrugated side wall, extending about a longitudinal axis, the side wall including: an alternation of crests and of troughs, forming corrugations; flanks, each flank extending between a crest and a trough, each corrugation having a first flank and a second flank that are opposite, separated by a same trough; the bellows includes at least one elementary electrical circuit associated with a corrugation, the elementary electrical circuit includes a first conductive element and a second conductive element, extending along the first flank and/or the second flank, the first conductive element being separated from the second conductive element; a first conductive track and a second conductive track, linked respectively to the first conductive element and to the second conductive element, and the first conductive track and the second conductive track are configured to be connected, to a detector of closure of the elementary electrical circuit.

Abstract: An instrumented mold formed by an assembly of strata includes, within the assembly of strata, a measurement structure provided with at least one pressure sensor and/or at least one temperature sensor or any other sensor capable of measuring a physical quantity, the structure typically being in the form of a flexible support housed between two strata.

Abstract: An optical detector with a curved detection surface is provided, including a photosensitive sensor; a support imposing a curvature on the photosensitive sensor; and a glue layer, provided between the photosensitive sensor and the support, with a thickness higher than 50 ?m. The glue layer with a high thickness enables requirements imposed on the sensor to be reduced, with an equal radius of curvature, and thus a minimum radius of curvature of the photosensitive sensor to be reduced, thereby compensating for significant defects of an imaging system located upstream.

Abstract: An optical detector with a curved detection surface is provided, including a photosensitive sensor; a support imposing a curvature on the photosensitive sensor; and a glue layer, provided between the photosensitive sensor and the support, with a thickness higher than 50 ?m. The glue layer with a high thickness enables requirements imposed on the sensor to be reduced, with an equal radius of curvature, and thus a minimum radius of curvature of the photosensitive sensor to be reduced, thereby compensating for significant defects of an imaging system located upstream.

Abstract: A micro-machined optical measuring device including: a set of photosensitive detector elements situated on a given face of a first support; a second support, assembled to the first support, forming a prism and including a first face through which a visible radiation is intended to penetrate and a second face, forming a non-zero angle ? with the first face and a non-zero angle ? with the given face of the first support, the second face being semi-reflective, the first support and the second support being positioned such that an interferometric cavity is made between the second face and the given face, the distance between the given face of the first support and the second face of the second support varying regularly.

Abstract: Infrared imagery device with integrated shield against parasite infrared radiation, and method of manufacturing the device. This device comprises a support provided with an infrared radiation detector, at least one optical device facing the detector, and a shield against parasite radiation. The shield comprises at least two continuous beads, spaced from each other, extending from the support as far as the optical device, provided with vents and made of a material that significantly attenuates parasite radiation, penetrating laterally between the support and the optical device. The two beads with their vents 15 form a baffle. The device is manufactured using the flip chip technique.

Abstract: The invention relates to a system and method for positioning and passively aligning at least one optical component as close as possible to an electromagnetic radiation detector. This system comprises supporting wedges (37) for Z positioning of the optical component (35) as close as possible to the detector (21) and passive X and Y alignment means via holding wedges and/or holding balls (36), the X, Y and Z axes being axes perpendicular to each other.

Abstract: The layout for an electronic component to be cooled during operation, said layout comprises a support (1) on which the electronic component (16) will be mounted, a base (2) configured so that it will be cooled, and a connecting element (3) mechanically and thermally connecting the base (2) to the support (1) so as to cool it. The connecting element (3) is configured such that the support (1) is free to move relative to the base (2), and the layout comprises a displacement adjustment system (4) configured so as to apply a movement to said support (1) relative to the base.

Abstract: A method of electrical connection between a series of hard conductive points and corresponding pads arranged on a one face of a first component, and a series of buried ductile conductive bumps and corresponding pads arranged on one face of a second component. The method comprises forming said series of hard conductive points on said face of the first component; forming said series of buried ductile conducting bumps on said face of the second component; inserting said series of hard conductive points in said series of buried ductile conducting bumps at an ambient temperature; and directly sealing the first and second components together.

Abstract: This method for producing a non-plane comprises fitting a flexible component onto a carrier by means of hybridization columns, each column having a first height and including a volume of solder material formed between two surfaces wettable by said solder material added to the flexible component and to the carrier respectively, said wettable surfaces being surrounded by zones non-wettable by the solder material, the wettable surfaces and the volume of solder material being determined as a function of a second height required for the flexible component relative to the carrier at the place where the column is formed, such that the column varies from the first height to the second height when the volume of material is brought to a temperature higher than or equal to its melting point and heating the volumes of solder material of the columns to a temperature higher than or equal to the melting point of said material in order to melt it.

Abstract: A micro-machined optical measuring device including: a set of photosensitive detector elements situated on a given face of a first support; a second support, assembled to the first support, forming a prism and including a first face through which a visible radiation is intended to penetrate and a second face, forming a non-zero angle ? with the first face and a non-zero angle ? with the given face of the first support, the second face being semi-reflective, the first support and the second support being positioned such that an interferometric cavity is made between the second face and the given face, the distance between the given face of the first support and the second face of the second support varying regularly.

Abstract: Infrared imagery device with integrated shield against parasite infrared radiation, and method of manufacturing the device. This device comprises a support (62) provided with an infrared radiation detector (40), at least one optical device (28) facing the detector, and a shield against parasite radiation. The shield comprises at least two continuous beads (c1, c2), spaced from each other, extending from the support as far as the optical device, provided with vents and made of a material that significantly attenuates parasite radiation, penetrating laterally between the support and the optical device. The two beads with their vents form a baffle. The device is manufactured using the flip chip technique.

Abstract: This method for producing a non-plane comprises fitting a flexible component onto a carrier by means of hybridization columns, each column having a first height and including a volume of solder material formed between two surfaces wettable by said solder material added to the flexible component and to the carrier respectively, said wettable surfaces being surrounded by zones non-wettable by the solder material, the wettable surfaces and the volume of solder material being determined as a function of a second height required for the flexible component relative to the carrier at the place where the column is formed, such that the column varies from the first height to the second height when the volume of material is brought to a temperature higher than or equal to its melting point and heating the volumes of solder material of the columns to a temperature higher than or equal to the melting point of said material in order to melt it.

Abstract: The invention relates to a method for producing a curved circuit. According to the invention, this method involves forming, in one face of said circuit and in at least one predetermined direction, cuts having a triangular cross-section which are parallel to each other and extend to either side of said circuit; depositing adhesive on the flanks of the cuts thus made; and moving the flanks of the cuts together so as to close them.

Abstract: The invention relates to a system and method for positioning and passively aligning at least one optical component as close as possible to an electromagnetic radiation detector. This system comprises supporting wedges (37) for Z positioning of the optical component (35) as close as possible to the detector (21) and passive X and Y alignment means via holding wedges and/or holding balls (36), the X, Y and Z axes being axes perpendicular to each other.

Abstract: The invention concerns a method of collective bonding of individual chips on a strained substrate (44), which comprises the following steps: functionalised layers (40) are arranged on a support (41), in an adjacent non-contiguous manner, with a space e between two neighboring layers (40), a calibrated drop of adhesive (43) is deposited on each of these functionalised layers, the strained substrate (44) is transferred onto these drops of adhesive, the parts of the assembly thereby formed are singularized to produce chips (45) bonded to the surface of strained substrate. The invention also concerns a method of placing under strain a semiconductor reading circuit by a substrate in a material of different coefficient of expansion.

Abstract: The invention concerns a method of collective bonding of individual chips on a strained substrate (44), which comprises the following steps: functionalised layers (40) are arranged on a support (41), in an adjacent non-contiguous manner, with a space e between two neighbouring layers (40), a calibrated drop of adhesive (43) is deposited on each of these functionalised layers, the strained substrate (44) is transferred onto these drops of adhesive, the parts of the assembly thereby formed are singularised to produce chips (45) bonded to the surface of strained substrate. The invention also concerns a method of placing under strain a semiconductor reading circuit by a substrate in a material of different coefficient of expansion.

Abstract: The invention concerns a method of electrical connection between a first component (10) comprising, on one face, a series of first pads (8) and a series of hard conductive points (13) and a second component (11) comprising, on one face, a series of second pads (9) and a series of ductile conductive bumps (14), in which one places opposite each other the two faces and one brings them together in such a way that the points (13) can penetrate into said bumps (14), in which the bumps are buried. The invention further concerns a component equipped with a series of buried ductile conductive bumps.