Abstract: An apparatus, a method and a system for testing a battery are disclosed. A voltage source adapted to apply a voltage to an assembly having a first battery electrode, a second battery electrode and a separator layer disposed between the first and second battery electrodes. A current logger is adapted to measure a current caused by partial discharges in the separator layer caused by the contaminants or voids in the separator layer, or at an interface between the first battery electrode and the separator layer, or at an interface between the second battery electrode and the separator layer, or in the separator layer. The voltage is less than a threshold value of a characteristic breakdown voltage of the separator layer.

Abstract: A system and method for predicting a remaining useful life of a cell of a battery is described. The system include a circuit adapted to provide a stimulus signal to the cell; a processor; a tangible, non-transitory computer readable medium that stores instructions, which when executed by the processor, cause the processor to: cycle a plurality of target cells for a test set of cycles; determine a set of features from data from reference cells; determine parameters of a computational model of the remaining useful life of the cell; apply a computational model using the determined set of feature values; and provide a prediction of the remaining useful life of target cells.

Abstract: An apparatus, a method and a system for testing a battery are disclosed. A voltage source adapted to apply a voltage to an assembly having a first battery electrode, a second battery electrode and a separator layer disposed between the first and second battery electrodes. A current logger is adapted to measure a current caused by partial discharges in the separator layer caused by the contaminants or voids in the separator layer, or at an interface between the first battery electrode and the separator layer, or at an interface between the second battery electrode and the separator layer, or in the separator layer. The voltage is less than a threshold value of a characteristic breakdown voltage of the separator layer.

Abstract: A method is for testing the structural integrity of a metal joint such as a weld. The method includes applying stress to the metal joint, and measuring a resistance of a circuit including the metal joint during application of the stress to the metal joint. A structural integrity of the metal joint is determined by comparing the measured resistance with a baseline resistance.

Abstract: A method is for testing the structural integrity of a metal joint such as a weld. The method includes applying stress to the metal joint, and measuring a resistance of a circuit including the metal joint during application of the stress to the metal joint. A structural integrity of the metal joint is determined by comparing the measured resistance with a baseline resistance.

Abstract: A method of calibrating an impedance measurement device for measuring DUT impedance includes performing short calibration measurements using a short calibration standard to obtain short raw data; performing first shunt calibration measurements using a first shunt calibration standard to obtain first raw data, the first shunt calibration standard having known first resistance and unknown first inductance; performing second shunt calibration measurements using a second shunt calibration standard to obtain second raw data, the second shunt calibration standard having known second resistance and unknown second inductance; determining first and second complex impedances of the first and second shunt calibration standards by calculating the first and second inductances using the short, first and second raw data applied to a specific error model; and determining general error coefficients for an error model using the first and second complex impedances and the first and second raw data applied to a one-port calibrat

Abstract: A method of calibrating an impedance measurement device for measuring DUT impedance includes performing short calibration measurements using a short calibration standard to obtain short raw data; performing first shunt calibration measurements using a first shunt calibration standard to obtain first raw data, the first shunt calibration standard having known first resistance and unknown first inductance; performing second shunt calibration measurements using a second shunt calibration standard to obtain second raw data, the second shunt calibration standard having known second resistance and unknown second inductance; determining first and second complex impedances of the first and second shunt calibration standards by calculating the first and second inductances using the short, first and second raw data applied to a specific error model; and determining general error coefficients for an error model using the first and second complex impedances and the first and second raw data applied to a one-port calibrat

Abstract: Calibration methods for microwave imaging (MI) systems are disclosed. According to an aspect, an MI system has a plurality of Vector Network Analyzer (VNA) ports operatively connected to a plurality of antennas. A multiple state calibration network having predetermined parameters is operatively connected between a first VNA port of the plurality of VNA ports and a first antenna of the plurality of antennas. A method of calibrating the MI system includes determining first, second, and third pluralities of reflection coefficients associated with the plurality of VNA ports using first, second, and third calibration scenarios; removing a measurement effect of the multiple calibration network from the first, second and third pluralities of reflection coefficients; and determining error parameters for each VNA port using the first, second, and third pluralities of reflection coefficients.