Abstract: A plug-in module. The plug-in module includes a module housing, a heat-dissipating device, and an electrical component arranged on a printed circuit board. The heat-dissipating device has, on a surface facing the electrical component, an internal thermal interface to thermally couple the electrical component to the heat-dissipating device. The heat-dissipating device has, on a surface facing away from the electrical component, an external thermal interface to thermally couple at least one heat-dissipating device to an external heat sink. The external thermal interface includes a thermally conductive elastic compensating element connected to the heat-dissipating device and designed to be compressed during formation of the external thermal interface.

Abstract: A heat dissipating device. The heat dissipating device includes a receiving area open on at least one side, and a mosaic segment, arranged in the receiving area, which includes a thermally conductive and elastic compensation element and a thermally conductive low-adherent contact region. The thermally conductive and elastic compensation element rests against the inner surface of the base of the receiving area. The thermally conductive low-adherent contact region at least partly protrudes out of the receiving area at the open face of the receiving area lying opposite the base. The outer surface of the base of the receiving area forms a rigid first contact surface for a heat source or a heat sink, and the thermally conductive low-adherent contact region of the at least one mosaic segment forms a flexible second contact surface for the heat sink or the source.