Abstract: Systems are provided for the arrangement of decoupled electric and acoustic modules for a transducer array of an ultrasound probe. In one embodiment, the decoupled modules are independently coupled to a flex interconnect, apart from one another, allowing for electric communication between all modules through the flex interconnect. As one example, an ultrasound transducer array for an ultrasound probe comprises an acoustic backing, a flex interconnect coupled to the backing at a first surface of the flex interconnect, a matrix acoustic array coupled to a second surface of the flex interconnect, the second surface opposite the first surface, and an electric module coupled to the second surface of the flex interconnect at a location spaced away from where the matrix acoustic array is coupled to the flex interconnect.

Abstract: Systems are provided for the arrangement of decoupled electric and acoustic modules for a transducer array of an ultrasound probe. In one embodiment, the decoupled modules are independently coupled to a flex interconnect, apart from one another, allowing for electric communication between all modules through the flex interconnect. As one example, an ultrasound transducer array for an ultrasound probe comprises an acoustic backing, a flex interconnect coupled to the backing at a first surface of the flex interconnect, a matrix acoustic array coupled to a second surface of the flex interconnect, the second surface opposite the first surface, and an electric module coupled to the second surface of the flex interconnect at a location spaced away from where the matrix acoustic array is coupled to the flex interconnect.

Abstract: An ultrasound probe and method of forming an ultrasound probe are provided. The ultrasound probe comprises a two-dimensional (2D) transducer assembly having transducer elements arranged in rows and columns. The transducer elements have front and rear surfaces. The front surface is configured to transmit and receive ultrasound signals to and from an object of interest. A thin film flex circuit extends along the rear surface of the transducer assembly. The flex circuit has conductive traces arranged in layers and enclosed within a common dielectric layer. The dielectric layer has a homogeneous composition surrounding the layers of the conductive traces. The conductive traces are electrically interconnected to the corresponding transducer elements.

Abstract: A medical imaging system and a method of ultrasound imaging with a tracking system includes identifying a volume-of-interest from a first ultrasound image acquired from a first position and orientation, tracking the probe using the tracking system as the probe is moved to a second position and orientation, calculating an orientation adjustment that should be applied to the probe from the second position and orientation to bring the volume-of-interest within a field-of-view of the probe, and displaying both a tilt graphical indicator and a rotation graphical indicator on a display device to illustrate the orientation adjustment.

Abstract: An ultrasound probe and method of forming an ultrasound probe are provided. The ultrasound probe comprises a two-dimensional (2D) transducer assembly having transducer elements arranged in rows and columns. The transducer elements have front and rear surfaces. The front surface is configured to transmit and receive ultrasound signals to and from an object of interest. A thin film flex circuit extends along the rear surface of the transducer assembly. The flex circuit has conductive traces arranged in layers and enclosed within a common dielectric layer. The dielectric layer has a homogeneous composition surrounding the layers of the conductive traces. The conductive traces are electrically interconnected to the corresponding transducer elements.

Abstract: Methods and systems are provided for an ultrasound probe including a small-angle adjustment element. In one embodiment, the small-angle adjustment element includes a piezoelectric actuator configured to rotate a transducer array of the ultrasound probe in response to electrical signals transmitted to the piezoelectric actuator. In this way, an amount of angle spanned by the transducer array during a scan of a region of interest may be reduced, thereby increasing a precision of the ultrasound probe.

Abstract: Systems are provided for the arrangement of decoupled electric and acoustic modules for a transducer array of an ultrasound probe. In one embodiment, the decoupled modules are independently coupled to a flex interconnect, apart from one another, allowing for electric communication between all modules through the flex interconnect. As one example, an ultrasound transducer array for an ultrasound probe comprises an acoustic backing, a flex interconnect coupled to the backing at a first surface of the flex interconnect, a matrix acoustic array coupled to a second surface of the flex interconnect, the second surface opposite the first surface, and an electric module coupled to the second surface of the flex interconnect at a location spaced away from where the matrix acoustic array is coupled to the flex interconnect.

Abstract: Methods and systems for connection to a transducer in ultrasound probes are provided. One system includes transducer having a base configured to support thereon an ultrasound transducer array and a plurality of electrical interconnects integrated with the base. The electrical interconnects are configured to connect to the ultrasound transducer array and extend along at least a portion of the base from the ultrasound transducer array.

Abstract: Methods and systems for connection to a transducer in ultrasound probes are provided. One system includes transducer having a base configured to support thereon an ultrasound transducer array and a plurality of electrical interconnects integrated with the base. The electrical interconnects are configured to connect to the ultrasound transducer array and extend along at least a portion of the base from the ultrasound transducer array.