Patents by Inventor Manuel Spona

Manuel Spona has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PCB assembly and method of manufacturing a PCB assembly
    Patent number: 11057983
    Abstract: The present invention provides a PCB assembly. The PCB assembly comprises a PCB board element comprising an outer surface, and a micro heat pipe configured for heat transport. The micro heat pipe has a pipe wall and at least a section of the pipe wall is connected to the outer surface of the PCB board element in a thermally conductive manner. The thermally conductive connection may comprise a solder connection. Thus, a corresponding micro heat pipe may comprise a pipe wall, wherein at least a section of the pipe wall is configured to be soldered to a PCB element. Furthermore, the present invention provides a corresponding method of manufacturing a PCB assembly.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: July 6, 2021
    Assignee: ROHDE & SCHWARZ GMBH & CO. KG
    Inventors: Josef Köppl, Andreas Geiss, Manuel Spona
  • PCB ASSEMBLY AND METHOD OF MANUFACTURING A PCB ASSEMBLY
    Publication number: 20200245446
    Abstract: The present invention provides a PCB assembly. The PCB assembly comprises a PCB board element comprising an outer surface, and a micro heat pipe configured for heat transport. The micro heat pipe has a pipe wall and at least a section of the pipe wall is connected to the outer surface of the PCB board element in a thermally conductive manner. The thermally conductive connection may comprise a solder connection. Thus, a corresponding micro heat pipe may comprise a pipe wall, wherein at least a section of the pipe wall is configured to be soldered to a PCB element. Furthermore, the present invention provides a corresponding method of manufacturing a PCB assembly.
    Type: Application
    Filed: January 30, 2019
    Publication date: July 30, 2020
    Inventors: Josef Köppl, Andreas Geiss, Manuel Spona