Abstract: An apparatus for implementing integrated circuit cooling during testing and image-based analysis thereof includes a lid configured to define a cavity surrounding an integrated circuit die, the die mounted to a module substrate. One or more fluid passages are defined within the lid, wherein the passages facilitate the flow of a cooling liquid through said cavity and over the integrated circuit die, and a transparent window is formed within the lid so as to facilitate viewing of the integrated circuit die.

Abstract: An apparatus for facilitating single die backside probing of semiconductor devices includes a chip holder configured for receiving a single integrated circuit die attached thereto, the chip holder maintained in flexible engagement in an X-Y orientation with respect to a lift plate. A lift ring is coupled to the lift plate, the lift ring configured to facilitate adjustment of the lift plate and the chip holder in a Z-direction.

Abstract: A structure of, and process for making, an improved heat exchanger. The exchanger may be used for heat transfer between air going to a space for human comfort, and humid, cooled air from an evaporative cooling system. The heat exchanger is made from a series of layers of thermoplastic sheeting spaced apart in a stack by uniquely shaped flat-topped dimples formed therein. The plates are joined together at their edges by adhesive and sealants and aerodynamically designed U-shaped clips. The clips are installed in a manner to form alternating channels of cooled and non-cooled air streams flowing perpendicularly to each other in the stack of plates. Special alignment detentes provide easier stacking and assembly of the plates.