Patents by Inventor Manuela Knipf

Manuela Knipf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and liquid preparation for removing residues of auxiliary sawing materials from wafers
    Patent number: 4900363
    Abstract: A process and liquid preparation is disclosed for removing residues from ers sawn from crystalline rods. In sawing rod-shaped workpieces such as semiconductor rods, for example, into wafers, by means of an internal-hole saw, auxiliary sawing materials such as for example cutting strips are often attached to the rods. According to the present invention, the residues of such auxiliary sawing materials remaining on the wafers obtained after the sawing operation can be removed particularly easily by means of immersion in baths of aqueous carboxylic solutions and, in particular, aqueous formic acid.
    Type: Grant
    Filed: March 25, 1988
    Date of Patent: February 13, 1990
    Assignee: Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe m.b.H.
    Inventors: Gerhard Brehm, Manuela Knipf, Rudolf Mayrhuber, Jurgen Schuhmacher, Max Stadler