Patents by Inventor Manuela Magugliani

Manuela Magugliani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
    Patent number: 8049287
    Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: November 1, 2011
    Assignee: STMicroelectronics S.r.l.
    Inventors: Chantal Combi, Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra, Caterina Riva
  • SUBSTRATE-LEVEL ASSEMBLY FOR AN INTEGRATED DEVICE, MANUFACTURING PROCESS THEREOF AND RELATED INTEGRATED DEVICE
    Publication number: 20080315333
    Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidically isolated from the first empty space, is provided over the respective membrane of the further integrated device.
    Type: Application
    Filed: April 14, 2008
    Publication date: December 25, 2008
    Applicant: STMicroelectronics S.r.l.
    Inventors: Chantal Combi, Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra, Caterina Riva
  • Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
    Patent number: RE46671
    Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: January 16, 2018
    Assignee: STMicroelectronics S.r.l.
    Inventors: Chantal Combi, Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra, Caterina Riva