Abstract: Operating IO-Link system having wirelessly connected IO-Link masters and several IO-Link devices divided into groups wirelessly connected by control system, at least one master with different configurations, one master with first configuration to operate first group of devices; a first process loop connected between at least one master and first group devices, checking communication status of connected devices of first group; at least second process loop reading devices of first group, setting configuration values for operation of first group devices, at least one master with at least second configuration operates at least second group of devices; at least third process loop connected between at least one master and devices of at least second group devices, checking communication status of connected devices of at least second group devices; at least fourth process loop reading devices of at least second group, setting configuration values for operation of at least second group devices.

Abstract: A strain measurement device (10) for electrically determining a strain of a basic body, having a carrier film (12) which can be applied to the basic body (40), an electric measuring loop (14) printed onto the carrier film (12) of conductive printing paste/printing ink, which has a measuring element (16) for generating an electrical signal based on the strain and which has four conducting tracks (18) connected to the measuring element (16) for four-wire sensing, the four conducting tracks (18) each having an electrical conductor connection (22), the conducting tracks (18), the conductor connections (22) and the measuring element (16) being printed with the same printing paste. Furthermore, an overall device (38) with such a strain measurement device (10), the strain measurement device (10) being connected to a base unit (44) which has an evaluation unit (46) and an energy supply unit (48).

Abstract: A fixing element for electrical devices, wherein at least one electrical device can be fixed to the fixing element, has at least one coupler, which forms at least one coupling to the at least one electrical device fixed to the fixing element, via which coupling electrical energy and/or data can be transmitted to the at least one electrical device, wherein the coupling is a capacitive and/or inductive coupling. In addition, equipment includes such a fixing element and a least one electrical device, which is fixed to the electrical element.

Abstract: A fixing element for electrical devices, wherein at least one electrical device can be fixed to the fixing element, has at least one coupler, which forms at least one coupling to the at least one electrical device fixed to the fixing element, via which coupling electrical energy and/or data can be transmitted to the at least one electrical device, wherein the coupling is a capacitive and/or inductive coupling. In addition, equipment includes such a fixing element and a least one electrical device, which is fixed to the electrical element.

Abstract: A microsystem for fluidic applications includes a substrate with a reservoir, a first microchannel, connected to the reservoir, and a second microchannel, separated from the first microchannel by a fixed member. The microsystem furthermore has an elastic film on the substrate, which film has a joint to the substrate around the reservoir and seals the reservoir. Here, the joint has a permanent joining area and, on the fixed member, a fixed member joining area that can be broken open and adjoins the permanent joining area at both ends of the fixed member. Such a microsystem forms a processing chip with reagent receptacle.

Abstract: A pinch valve, a chip including the pinch valve, a peristaltic pump including the pinch valve and a method for manufacturing the pinch valve. The pinch valve includes a first substrate, a second substrate, and a third substrate. The third substrate is formed from an elastic material and situated between the first and second substrates. The first substrate adjoins the third substrate and includes at least one first recess on the side adjacent to the third substrate. The second substrate adjoins the third substrate and includes at least one second recess on the side adjacent to the third substrate. The first recess and the second recess are situated at least partially opposite each other.

Abstract: A method for producing a multilayer system with at least two joining elements, these being produced in particular from plastic, is disclosed. The method includes applying a compensating means, for at least partially compensating for mechanical stresses, to a first joining element, applying a second joining element to the compensating means, for joining together the first and second joining elements, firstly connecting the first joining element to the compensating means and secondly connecting the second joining element to the compensating means. A corresponding multilayer system and a corresponding use is also disclosed.

Abstract: A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module.

Abstract: A microsystem for fluidic applications includes a substrate with a reservoir, a first microchannel, connected to the reservoir, and a second microchannel, separated from the first microchannel by a web. The microsystem furthermore has an elastic film on the substrate, which film has a joint to the substrate around the reservoir and seals the reservoir. Here, the joint has a permanent joining area and, on the web, a web joining area that can be broken open and adjoins the permanent joining area at both ends of the web. Such a microsystem forms a processing chip with reagent receptacle.

Abstract: A method for producing a multilayer system with at least two joining elements, these being produced in particular from plastic, is disclosed. The method includes applying a compensating means, for at least partially compensating for mechanical stresses, to a first joining element, applying a second joining element to the compensating means, for joining together the first and second joining elements, firstly connecting the first joining element to the compensating means and secondly connecting the second joining element to the compensating means. A corresponding multilayer system and a corresponding use is also disclosed.

Abstract: A pinch valve, a chip including a pinch valve of this type, a peristaltic pump including a pinch valve of this type and a method for manufacturing same. The pinch valve includes a first substrate, a second substrate, and a third substrate, the third substrate being farmed from an elastic material and situated between the first and second substrates, the first substrate adjoining the third substrate and having at least one first recess on the side adjacent to the third substrate, the second substrate adjoining the third substrate and having at least one second recess on the side adjacent to the third substrate, the first recess and the second recess being situated at least partially opposite each other.

Abstract: A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module.